JPH0193737U - - Google Patents
Info
- Publication number
- JPH0193737U JPH0193737U JP19118487U JP19118487U JPH0193737U JP H0193737 U JPH0193737 U JP H0193737U JP 19118487 U JP19118487 U JP 19118487U JP 19118487 U JP19118487 U JP 19118487U JP H0193737 U JPH0193737 U JP H0193737U
- Authority
- JP
- Japan
- Prior art keywords
- chip tray
- recesses
- independent rectangular
- chip
- rectangular recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は、本考案によるＩＣチツプトレイの斜
視図であり、第２図は従来のＩＣチツプトレイの
斜視図である。第３図は、ＩＣチツプの正面図で
あり、第４図は、ＩＣチツプ実装時の断面模式図
である。第５図は、本考案によるＩＣチツプトレ
イを用いた異物除去時の断面模式図である。
１……ＩＣチツプトレイ、２……ＩＣチツプ、
３……凹部、４……ふた、５……能動面、６……
異物、７……電極、８……信号リード、９……加
熱加圧ヘツド、１０……支持台、２０……貫通穴
、２１……エアー、２２……エアーパイプ、２３
……支持台。
FIG. 1 is a perspective view of an IC chip tray according to the present invention, and FIG. 2 is a perspective view of a conventional IC chip tray. FIG. 3 is a front view of the IC chip, and FIG. 4 is a schematic cross-sectional view when the IC chip is mounted. FIG. 5 is a schematic cross-sectional view when removing foreign matter using the IC chip tray according to the present invention. 1...IC chip tray, 2...IC chip,
3... recess, 4... lid, 5... active surface, 6...
Foreign matter, 7... Electrode, 8... Signal lead, 9... Heating and pressure head, 10... Support stand, 20... Through hole, 21... Air, 22... Air pipe, 23
...Support stand.
Claims (1)
有する板状部材から成るＩＣチツプトレイにおい
て、前記複数の独立した矩形の凹部中に、前記凹
部形成面とは反対の面まで貫通する穴を有するこ
とを特徴とするＩＣチツプトレイ。 An IC chip tray made of a plate-like member having a plurality of independent rectangular recesses on at least one surface, characterized in that each of the plurality of independent rectangular recesses has a hole penetrating to a surface opposite to the surface on which the recesses are formed. IC chip tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19118487U JPH0193737U (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19118487U JPH0193737U (en) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193737U true JPH0193737U (en) | 1989-06-20 |
Family
ID=31482109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19118487U Pending JPH0193737U (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193737U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091067A (en) * | 2009-10-20 | 2011-05-06 | Hitachi Displays Ltd | Bonding device and method |
| JP2012041056A (en) * | 2010-08-17 | 2012-03-01 | Disco Corp | Storage tray and method of handling package substrate |
-
1987
- 1987-12-16 JP JP19118487U patent/JPH0193737U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091067A (en) * | 2009-10-20 | 2011-05-06 | Hitachi Displays Ltd | Bonding device and method |
| JP2012041056A (en) * | 2010-08-17 | 2012-03-01 | Disco Corp | Storage tray and method of handling package substrate |
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