JPH0193730U - - Google Patents
Info
- Publication number
- JPH0193730U JPH0193730U JP19116087U JP19116087U JPH0193730U JP H0193730 U JPH0193730 U JP H0193730U JP 19116087 U JP19116087 U JP 19116087U JP 19116087 U JP19116087 U JP 19116087U JP H0193730 U JPH0193730 U JP H0193730U
- Authority
- JP
- Japan
- Prior art keywords
- sample
- view
- sample holder
- showing
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- ing And Chemical Polishing (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19116087U JPH0193730U (cs) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19116087U JPH0193730U (cs) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193730U true JPH0193730U (cs) | 1989-06-20 |
Family
ID=31482085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19116087U Pending JPH0193730U (cs) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193730U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008875A (ja) * | 2011-06-24 | 2013-01-10 | Hitachi Chem Co Ltd | 半導体パッケージの開封方法、及び半導体パッケージの検査方法 |
-
1987
- 1987-12-16 JP JP19116087U patent/JPH0193730U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008875A (ja) * | 2011-06-24 | 2013-01-10 | Hitachi Chem Co Ltd | 半導体パッケージの開封方法、及び半導体パッケージの検査方法 |