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Filing date
Publication date
Application filedfiledCritical
Priority to JP1987184531UpriorityCriticalpatent/JPH0190242U/ja
Publication of JPH0190242UpublicationCriticalpatent/JPH0190242U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
H01L2224/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
H01L2924/161—Cap
H01L2924/1615—Shape
H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap