JPH0189741U - - Google Patents

Info

Publication number
JPH0189741U
JPH0189741U JP1987185475U JP18547587U JPH0189741U JP H0189741 U JPH0189741 U JP H0189741U JP 1987185475 U JP1987185475 U JP 1987185475U JP 18547587 U JP18547587 U JP 18547587U JP H0189741 U JPH0189741 U JP H0189741U
Authority
JP
Japan
Prior art keywords
integrated circuit
protective film
operating section
functional operating
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987185475U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987185475U priority Critical patent/JPH0189741U/ja
Publication of JPH0189741U publication Critical patent/JPH0189741U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP1987185475U 1987-12-04 1987-12-04 Pending JPH0189741U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987185475U JPH0189741U (zh) 1987-12-04 1987-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987185475U JPH0189741U (zh) 1987-12-04 1987-12-04

Publications (1)

Publication Number Publication Date
JPH0189741U true JPH0189741U (zh) 1989-06-13

Family

ID=31476790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987185475U Pending JPH0189741U (zh) 1987-12-04 1987-12-04

Country Status (1)

Country Link
JP (1) JPH0189741U (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444397A (ja) * 1990-06-11 1992-02-14 Alps Electric Co Ltd 電子部品の製造方法
JPH08186109A (ja) * 1994-12-28 1996-07-16 Nec Corp 半導体集積回路装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0444397A (ja) * 1990-06-11 1992-02-14 Alps Electric Co Ltd 電子部品の製造方法
JPH08186109A (ja) * 1994-12-28 1996-07-16 Nec Corp 半導体集積回路装置

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