JPH0188469U - - Google Patents
Info
- Publication number
- JPH0188469U JPH0188469U JP18417987U JP18417987U JPH0188469U JP H0188469 U JPH0188469 U JP H0188469U JP 18417987 U JP18417987 U JP 18417987U JP 18417987 U JP18417987 U JP 18417987U JP H0188469 U JPH0188469 U JP H0188469U
- Authority
- JP
- Japan
- Prior art keywords
- pair
- leaf springs
- soldering
- cutting
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18417987U JPH0188469U (fr) | 1987-12-01 | 1987-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18417987U JPH0188469U (fr) | 1987-12-01 | 1987-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0188469U true JPH0188469U (fr) | 1989-06-12 |
Family
ID=31475557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18417987U Pending JPH0188469U (fr) | 1987-12-01 | 1987-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0188469U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271972U (fr) * | 1988-11-22 | 1990-05-31 |
-
1987
- 1987-12-01 JP JP18417987U patent/JPH0188469U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271972U (fr) * | 1988-11-22 | 1990-05-31 |