JPH0187865U - - Google Patents
Info
- Publication number
- JPH0187865U JPH0187865U JP18463587U JP18463587U JPH0187865U JP H0187865 U JPH0187865 U JP H0187865U JP 18463587 U JP18463587 U JP 18463587U JP 18463587 U JP18463587 U JP 18463587U JP H0187865 U JPH0187865 U JP H0187865U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- adhered
- abrasive
- support
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 4
- 239000010419 fine particle Substances 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
Description
第１図は、本考案の研磨テープを例示する断面
部分図である。第２図は、本考案にて使用し得る
金属樹脂ラミネートテープの断面部分図である。
１……研磨テープ、２，４……金属テープ、３
……研磨材微粒子、２′……金属樹脂ラミネート
テープ、５……合成樹脂テープ。
FIG. 1 is a partial cross-sectional view illustrating the abrasive tape of the present invention. FIG. 2 is a partial cross-sectional view of a metal-resin laminate tape that can be used in the present invention. 1... Polishing tape, 2, 4... Metal tape, 3
...Abrasive fine particles, 2'...Metal resin laminate tape, 5...Synthetic resin tape.
Claims (1)
テープから選ばれた強度のある可撓性支持体の金
属テープ面上に、研磨材微粒子を実質的に均一に
付着せしめた構造を特徴とする、研磨むらを低減
した研磨テープ。 (2) 研磨材微粒子を高分子系結合剤によつて該
支持体上に付着せしめた構造である、登録請求の
範囲第１項の研磨テープ。 (3) 研磨材微粒子を熔着によつて該支持体上に
付着せしめた構造である、登録請求の範囲第１項
の研磨テープ。[Claims for Utility Model Registration] (1) Fine abrasive particles are substantially uniformly adhered to the metal tape surface of a strong flexible support selected from metal tapes and metal synthetic resin laminate tapes. A polishing tape with a unique structure that reduces polishing unevenness. (2) The polishing tape according to claim 1, which has a structure in which fine abrasive particles are adhered to the support using a polymeric binder. (3) The abrasive tape according to claim 1, which has a structure in which abrasive fine particles are adhered to the support by welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18463587U JPH0187865U (en) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18463587U JPH0187865U (en) | 1987-12-02 | 1987-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187865U true JPH0187865U (en) | 1989-06-09 |
Family
ID=31475980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18463587U Pending JPH0187865U (en) | 1987-12-02 | 1987-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187865U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60255366A (en) * | 1984-05-29 | 1985-12-17 | Sumitomo Electric Ind Ltd | Preparation of diamond grinding paper |
| JPS6260725A (en) * | 1985-09-11 | 1987-03-17 | Ricoh Co Ltd | Paper feeder for printer |
-
1987
- 1987-12-02 JP JP18463587U patent/JPH0187865U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60255366A (en) * | 1984-05-29 | 1985-12-17 | Sumitomo Electric Ind Ltd | Preparation of diamond grinding paper |
| JPS6260725A (en) * | 1985-09-11 | 1987-03-17 | Ricoh Co Ltd | Paper feeder for printer |
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