JPH0186252U - - Google Patents
Info
- Publication number
- JPH0186252U JPH0186252U JP18268587U JP18268587U JPH0186252U JP H0186252 U JPH0186252 U JP H0186252U JP 18268587 U JP18268587 U JP 18268587U JP 18268587 U JP18268587 U JP 18268587U JP H0186252 U JPH0186252 U JP H0186252U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- semiconductor device
- positioning foot
- section
- contact portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18268587U JPH0186252U (cs) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18268587U JPH0186252U (cs) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186252U true JPH0186252U (cs) | 1989-06-07 |
Family
ID=31474129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18268587U Pending JPH0186252U (cs) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186252U (cs) |
-
1987
- 1987-11-30 JP JP18268587U patent/JPH0186252U/ja active Pending