JPH0186241U - - Google Patents

Info

Publication number
JPH0186241U
JPH0186241U JP18250287U JP18250287U JPH0186241U JP H0186241 U JPH0186241 U JP H0186241U JP 18250287 U JP18250287 U JP 18250287U JP 18250287 U JP18250287 U JP 18250287U JP H0186241 U JPH0186241 U JP H0186241U
Authority
JP
Japan
Prior art keywords
plunger
heater
mold
resin
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18250287U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18250287U priority Critical patent/JPH0186241U/ja
Publication of JPH0186241U publication Critical patent/JPH0186241U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Pistons, Piston Rings, And Cylinders (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例１を示す断面図、第２
図は本考案の実施例２を示す断面図、第３図は第
２図のＡ―Ａ線断面図、第４図は従来の樹脂封止
装置の金型及びプランジヤ部の縦断面図である。 １…樹脂（タブレツト）、２…プランジヤ継手
、３…プランジヤヘツド、４…棒状ヒータ、５…
ヒータ電源、６…樹脂押圧面、７…小線径ヒータ
、８…上金型、９…下金型。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金型にプランジヤを嵌合挿入しプラスチツク樹
    脂の成形を行なう半導体装置の樹脂封止装置にお
    いて、前記プランジヤ先端内部にプランジヤを加
    熱するヒータを組み込んだことを特徴とする半導
    体装置の樹脂封止装置。
JP18250287U 1987-11-30 1987-11-30 Pending JPH0186241U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18250287U JPH0186241U (ja) 1987-11-30 1987-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18250287U JPH0186241U (ja) 1987-11-30 1987-11-30

Publications (1)

Publication Number Publication Date
JPH0186241U true JPH0186241U (ja) 1989-06-07

Family

ID=31473949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18250287U Pending JPH0186241U (ja) 1987-11-30 1987-11-30

Country Status (1)

Country Link
JP (1) JPH0186241U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821530A (ja) * 1994-07-07 1996-01-23 Inoue Seisakusho:Kk 加圧押出装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251633A (ja) * 1984-05-28 1985-12-12 Michio Osada トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置
JPS6136940A (ja) * 1984-07-30 1986-02-21 Sumitomo Electric Ind Ltd 半導体樹脂封止装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251633A (ja) * 1984-05-28 1985-12-12 Michio Osada トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置
JPS6136940A (ja) * 1984-07-30 1986-02-21 Sumitomo Electric Ind Ltd 半導体樹脂封止装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0821530A (ja) * 1994-07-07 1996-01-23 Inoue Seisakusho:Kk 加圧押出装置

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