JPH0186237U - - Google Patents
Info
- Publication number
- JPH0186237U JPH0186237U JP1987183465U JP18346587U JPH0186237U JP H0186237 U JPH0186237 U JP H0186237U JP 1987183465 U JP1987183465 U JP 1987183465U JP 18346587 U JP18346587 U JP 18346587U JP H0186237 U JPH0186237 U JP H0186237U
- Authority
- JP
- Japan
- Prior art keywords
- supply device
- cylinder
- solder
- solder supply
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0113—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987183465U JPH0186237U (enExample) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987183465U JPH0186237U (enExample) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186237U true JPH0186237U (enExample) | 1989-06-07 |
Family
ID=31474886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987183465U Pending JPH0186237U (enExample) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186237U (enExample) |
-
1987
- 1987-11-30 JP JP1987183465U patent/JPH0186237U/ja active Pending