JPH0184870U - - Google Patents
Info
- Publication number
- JPH0184870U JPH0184870U JP1987179089U JP17908987U JPH0184870U JP H0184870 U JPH0184870 U JP H0184870U JP 1987179089 U JP1987179089 U JP 1987179089U JP 17908987 U JP17908987 U JP 17908987U JP H0184870 U JPH0184870 U JP H0184870U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- preliminary
- mounting jig
- component mounting
- solder dip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987179089U JPH0184870U (cs) | 1987-11-25 | 1987-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987179089U JPH0184870U (cs) | 1987-11-25 | 1987-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184870U true JPH0184870U (cs) | 1989-06-06 |
Family
ID=31470672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987179089U Pending JPH0184870U (cs) | 1987-11-25 | 1987-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184870U (cs) |
-
1987
- 1987-11-25 JP JP1987179089U patent/JPH0184870U/ja active Pending