JPH0184468U - - Google Patents
Info
- Publication number
- JPH0184468U JPH0184468U JP1987180180U JP18018087U JPH0184468U JP H0184468 U JPH0184468 U JP H0184468U JP 1987180180 U JP1987180180 U JP 1987180180U JP 18018087 U JP18018087 U JP 18018087U JP H0184468 U JPH0184468 U JP H0184468U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- conductive pattern
- lands
- substrate
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987180180U JPH0184468U (de) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987180180U JPH0184468U (de) | 1987-11-26 | 1987-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0184468U true JPH0184468U (de) | 1989-06-05 |
Family
ID=31471704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987180180U Pending JPH0184468U (de) | 1987-11-26 | 1987-11-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0184468U (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021174975A (ja) * | 2020-04-30 | 2021-11-01 | Necプラットフォームズ株式会社 | プリント基板及びプリント基板の製造方法 |
-
1987
- 1987-11-26 JP JP1987180180U patent/JPH0184468U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021174975A (ja) * | 2020-04-30 | 2021-11-01 | Necプラットフォームズ株式会社 | プリント基板及びプリント基板の製造方法 |