JPH0184439U - - Google Patents
Info
- Publication number
- JPH0184439U JPH0184439U JP1987180480U JP18048087U JPH0184439U JP H0184439 U JPH0184439 U JP H0184439U JP 1987180480 U JP1987180480 U JP 1987180480U JP 18048087 U JP18048087 U JP 18048087U JP H0184439 U JPH0184439 U JP H0184439U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder
- scratches
- irregularly shaped
- cleavage direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003776 cleavage reaction Methods 0.000 claims 3
- 230000007017 scission Effects 0.000 claims 3
- 230000001788 irregular Effects 0.000 description 1
Description
第１図イは本考案に係るウエーハ分割装置の平
面図、第１図ロは第１図イの―線断面図、第
２図は傷入れが行われた不定形ウエーハの一例を
示す斜視図、第３図はウエーハ分割装置の従来例
を示す平面図、第４図は第３図の―線断面図
である。
２１……ホルダー、２３……マウント用テープ
、２４……カバーテープ、２５……凸板、２６…
…押圧部材、２６ａ……底面、２６ｂ……凹溝、
Ａ……不定形ウエーハ、Ｃ……傷部。
FIG. 1A is a plan view of the wafer dividing apparatus according to the present invention, FIG. 1B is a sectional view taken along the line -- in FIG. , FIG. 3 is a plan view showing a conventional example of a wafer dividing apparatus, and FIG. 4 is a sectional view taken along the line -- in FIG. 21... Holder, 23... Mounting tape, 24... Cover tape, 25... Convex plate, 26...
...pressing member, 26a...bottom surface, 26b...concave groove,
A... Irregular wafer, C... Scratched area.
Claims (1)
れた不定形ウエーハを、傷部を基準として劈開方
向に分割するためのウエーハ分割装置を、 上記不定形ウエーハをシート状をした２枚のテ
ープ間に挟持した状態で保持するホルダと、 ホルダに保持された不定形ウエーハの傷部上方
に上下動自在に配置され、かつ、不定形ウエーハ
の傷部を有する上面を押圧する底面に不定形ウエ
ーハの劈開方向に沿つた凹溝が形成された押圧部
材と、 ホルダに保持された不定形ウエーハの下面側に
、不定形ウエーハの劈開方向に沿い、かつ、上記
傷部と対向するように配置され上記押圧板の凹溝
と対応嵌挿可能な凸板とによつて構成したことを
特徴とするウエーハ分割装置。[Claims for Utility Model Registration] A wafer dividing device for dividing an irregularly shaped wafer in which scratches facing the cleavage direction are formed at equal intervals on one side in the cleavage direction with the scratches as a reference; A holder that holds a wafer sandwiched between two sheet-shaped tapes, and a holder that is movable up and down above the scratches on the irregularly shaped wafer held in the holder, and a pressing member having a concave groove formed in the bottom surface that presses the upper surface thereof along the cleavage direction of the irregularly shaped wafer; A wafer dividing device, characterized in that it is constructed of a convex plate that is arranged to face the scratched portion and that can be fitted into the concave groove of the press plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180480U JPH0184439U (en) | 1987-11-26 | 1987-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987180480U JPH0184439U (en) | 1987-11-26 | 1987-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0184439U true JPH0184439U (en) | 1989-06-05 |
Family
ID=31471998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987180480U Pending JPH0184439U (en) | 1987-11-26 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0184439U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009149046A (en) * | 2007-11-28 | 2009-07-09 | Denso Corp | Manufacturing method for board |
-
1987
- 1987-11-26 JP JP1987180480U patent/JPH0184439U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009149046A (en) * | 2007-11-28 | 2009-07-09 | Denso Corp | Manufacturing method for board |
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