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Filing date
Publication date
Application filedfiledCritical
Priority to JP1987179536UpriorityCriticalpatent/JPH0512207Y2/ja
Publication of JPH0183769UpublicationCriticalpatent/JPH0183769U/ja
Application grantedgrantedCritical
Publication of JPH0512207Y2publicationCriticalpatent/JPH0512207Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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Storage Of Web-Like Or Filamentary Materials
(AREA)
