JPH0183387U - - Google Patents

Info

Publication number
JPH0183387U
JPH0183387U JP1987178314U JP17831487U JPH0183387U JP H0183387 U JPH0183387 U JP H0183387U JP 1987178314 U JP1987178314 U JP 1987178314U JP 17831487 U JP17831487 U JP 17831487U JP H0183387 U JPH0183387 U JP H0183387U
Authority
JP
Japan
Prior art keywords
circuit board
soldering
housed
wound
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987178314U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987178314U priority Critical patent/JPH0183387U/ja
Publication of JPH0183387U publication Critical patent/JPH0183387U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1987178314U 1987-11-25 1987-11-25 Pending JPH0183387U (US06818201-20041116-C00086.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987178314U JPH0183387U (US06818201-20041116-C00086.png) 1987-11-25 1987-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987178314U JPH0183387U (US06818201-20041116-C00086.png) 1987-11-25 1987-11-25

Publications (1)

Publication Number Publication Date
JPH0183387U true JPH0183387U (US06818201-20041116-C00086.png) 1989-06-02

Family

ID=31469937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987178314U Pending JPH0183387U (US06818201-20041116-C00086.png) 1987-11-25 1987-11-25

Country Status (1)

Country Link
JP (1) JPH0183387U (US06818201-20041116-C00086.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020194952A (ja) * 2019-05-24 2020-12-03 Nissha株式会社 筒状プリント基板およびプリント基板一体成形品
CN113557799B (zh) * 2019-05-24 2024-10-29 日写株式会社 印刷基板一体成形品

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020194952A (ja) * 2019-05-24 2020-12-03 Nissha株式会社 筒状プリント基板およびプリント基板一体成形品
CN113557799A (zh) * 2019-05-24 2021-10-26 日写株式会社 筒状印刷基板以及印刷基板一体成形品
US11324114B2 (en) 2019-05-24 2022-05-03 Nissha Co., Ltd. Cylindrical printed board and printed-board-integrated molded article
CN113557799B (zh) * 2019-05-24 2024-10-29 日写株式会社 印刷基板一体成形品

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