JPH0183364U - - Google Patents
Info
- Publication number
- JPH0183364U JPH0183364U JP1987177945U JP17794587U JPH0183364U JP H0183364 U JPH0183364 U JP H0183364U JP 1987177945 U JP1987177945 U JP 1987177945U JP 17794587 U JP17794587 U JP 17794587U JP H0183364 U JPH0183364 U JP H0183364U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- wiring board
- circuit wiring
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987177945U JPH0183364U (nl) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987177945U JPH0183364U (nl) | 1987-11-20 | 1987-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0183364U true JPH0183364U (nl) | 1989-06-02 |
Family
ID=31469590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987177945U Pending JPH0183364U (nl) | 1987-11-20 | 1987-11-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0183364U (nl) |
-
1987
- 1987-11-20 JP JP1987177945U patent/JPH0183364U/ja active Pending