JPH0183361U - - Google Patents

Info

Publication number

JPH0183361U

JPH0183361U JP1987178200U JP17820087U JPH0183361U JP H0183361 U JPH0183361 U JP H0183361U JP 1987178200 U JP1987178200 U JP 1987178200U JP 17820087 U JP17820087 U JP 17820087U JP H0183361 U JPH0183361 U JP H0183361U

Authority

JP

Japan

Prior art keywords

hole

wiring board

circuit wiring

solder resist

model registration

Prior art date

1987-11-21

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 4
• 239000004020 conductor Substances 0.000 claims description 3
• 230000002093 peripheral effect Effects 0.000 claims 2
• 239000011521 glass Substances 0.000 claims 1
• 239000000463 material Substances 0.000 claims 1
• 239000011347 resin Substances 0.000 claims 1
• 229920005989 resin Polymers 0.000 claims 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 238000000034 method Methods 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1