JPH0182557U - - Google Patents

Info

Publication number
JPH0182557U
JPH0182557U JP1987178451U JP17845187U JPH0182557U JP H0182557 U JPH0182557 U JP H0182557U JP 1987178451 U JP1987178451 U JP 1987178451U JP 17845187 U JP17845187 U JP 17845187U JP H0182557 U JPH0182557 U JP H0182557U
Authority
JP
Japan
Prior art keywords
solid
image sensor
state image
imaging device
additionally machined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987178451U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987178451U priority Critical patent/JPH0182557U/ja
Publication of JPH0182557U publication Critical patent/JPH0182557U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】
第１図及び第２図は本考案固体撮像装置の第１
の実施例を説明するためのもので、第１図は固体
撮像装置の一部切欠分解斜視図、第２図は位置合
せ基準部形成前のパツケージの一部切欠斜視図、
第３図は第１の実施例の第１の変形例を示す分解
斜視図、第４図は同じく第２の変形例を示す一部
切欠分解斜視図、第５は本考案固体撮像装置の第
２の実施例を示す分解斜視図、第６図は固体撮像
装置の従来例を示す分解斜視図である。 符号の説明、１…固体撮像素子支持体、２…固
体撮像素子、９ａ，９ｂ，１１ａ，１１ｂ，１２
ｂ，１４ａ，１４ｂ…追加工可能部分、１０ａ，
１０ｂ，１５ａ，１５ｂ…位置合せ基準部。
補正 昭６３．２．２９ 図面の簡単な説明を次のように補正する。 明細書第１２頁８行目、「第５」と「は本考案
」との間に「図」を挿入する。

Claims (1)

  1. 【実用新案登録請求の範囲】 固体撮像素子を支持する固体撮像素子支持体に
    追加工が可能な追加工可能部分が設けられ、 上記追加工可能部分に固体撮像素子と所定の位
    置関係を有するように追加工することにより形成
    された位置合せ基準部が設けられてなる ことを特徴とする固体撮像装置。
JP1987178451U 1987-11-24 1987-11-24 Pending JPH0182557U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987178451U JPH0182557U (ja) 1987-11-24 1987-11-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987178451U JPH0182557U (ja) 1987-11-24 1987-11-24

Publications (1)

Publication Number Publication Date
JPH0182557U true JPH0182557U (ja) 1989-06-01

Family

ID=31470067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987178451U Pending JPH0182557U (ja) 1987-11-24 1987-11-24

Country Status (1)

Country Link
JP (1) JPH0182557U (ja)

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