JPH0180473U - - Google Patents
Info
- Publication number
- JPH0180473U JPH0180473U JP1987176324U JP17632487U JPH0180473U JP H0180473 U JPH0180473 U JP H0180473U JP 1987176324 U JP1987176324 U JP 1987176324U JP 17632487 U JP17632487 U JP 17632487U JP H0180473 U JPH0180473 U JP H0180473U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor element
- semiconductor
- mounting structure
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176324U JPH088138Y2 (ja) | 1987-11-20 | 1987-11-20 | 半導体の実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176324U JPH088138Y2 (ja) | 1987-11-20 | 1987-11-20 | 半導体の実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0180473U true JPH0180473U (US06432973-20020813-C00010.png) | 1989-05-30 |
| JPH088138Y2 JPH088138Y2 (ja) | 1996-03-06 |
Family
ID=31468065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176324U Expired - Lifetime JPH088138Y2 (ja) | 1987-11-20 | 1987-11-20 | 半導体の実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088138Y2 (US06432973-20020813-C00010.png) |
-
1987
- 1987-11-20 JP JP1987176324U patent/JPH088138Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH088138Y2 (ja) | 1996-03-06 |
