JPH0179872U - - Google Patents

Info

Publication number

JPH0179872U

JPH0179872U JP1987176101U JP17610187U JPH0179872U JP H0179872 U JPH0179872 U JP H0179872U JP 1987176101 U JP1987176101 U JP 1987176101U JP 17610187 U JP17610187 U JP 17610187U JP H0179872 U JPH0179872 U JP H0179872U

Authority

JP

Japan

Prior art keywords

wiring board

printed circuit

circuit wiring

metal foil

shield

Prior art date

1987-11-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 239000011888 foil Substances 0.000 claims 2
• 239000002184 metal Substances 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1