JPH0179828U - - Google Patents
Info
- Publication number
- JPH0179828U JPH0179828U JP1987175823U JP17582387U JPH0179828U JP H0179828 U JPH0179828 U JP H0179828U JP 1987175823 U JP1987175823 U JP 1987175823U JP 17582387 U JP17582387 U JP 17582387U JP H0179828 U JPH0179828 U JP H0179828U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grooves
- plate
- base plate
- stand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 1
Description
第１図は、本考案の実施例を示すａ正面図、ｂ
側面図、ｃＡ−Ａ矢視図、第２図は、従来例を示
すａ正面図、ｂ側面図、ｃＢ−Ｂ矢視図、第３図
は、従来例の要部正面図である。
１……支柱（支持部材）、２……天板、３……
台板、４……ウエハ、５……オリフラ、６……溝
、１０，１０′……ボード（ウエハ支持装置）、
１１……板状支柱、１２……溝。
Figure 1 is a front view and b is a front view showing an embodiment of the present invention.
A side view, cA-A arrow view, FIG. 2 is a front view, b side view, cB-B arrow view showing a conventional example, and FIG. 3 is a front view of main parts of the conventional example. 1... Support column (supporting member), 2... Top plate, 3...
Base plate, 4... wafer, 5... orientation flat, 6... groove, 10, 10'... board (wafer support device),
11...Plate-shaped support, 12...Groove.
Claims (1)
溝を設けた複数本の支持部材の上下両端に、天板
および台板を固着し、台板前方向からウエハを前
記溝内に挿入してウエハの端部を保持するように
構成された縦型熱処理炉用のウエハ支持装置であ
つて、前記支持部材を切り込みの深い溝を設けた
板状材としたことを特徴とするウエハ支持装置。 A top plate and a base plate are fixed to the upper and lower ends of a plurality of supporting members that stand almost vertically and have grooves for holding wafers at predetermined locations, and the wafer is inserted into the grooves from the front of the base plate. A wafer support device for a vertical heat treatment furnace configured to hold an end portion of a wafer, characterized in that the support member is a plate-shaped member provided with a deep groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175823U JPH0621246Y2 (en) | 1987-11-19 | 1987-11-19 | Wafer support device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175823U JPH0621246Y2 (en) | 1987-11-19 | 1987-11-19 | Wafer support device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0179828U true JPH0179828U (en) | 1989-05-29 |
| JPH0621246Y2 JPH0621246Y2 (en) | 1994-06-01 |
Family
ID=31467602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175823U Expired - Lifetime JPH0621246Y2 (en) | 1987-11-19 | 1987-11-19 | Wafer support device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621246Y2 (en) |
-
1987
- 1987-11-19 JP JP1987175823U patent/JPH0621246Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621246Y2 (en) | 1994-06-01 |
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