JPH0178040U - - Google Patents
Info
- Publication number
- JPH0178040U JPH0178040U JP1987173897U JP17389787U JPH0178040U JP H0178040 U JPH0178040 U JP H0178040U JP 1987173897 U JP1987173897 U JP 1987173897U JP 17389787 U JP17389787 U JP 17389787U JP H0178040 U JPH0178040 U JP H0178040U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- wiring board
- printed wiring
- semiconductor element
- rubber sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173897U JPH0178040U (it) | 1987-11-16 | 1987-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173897U JPH0178040U (it) | 1987-11-16 | 1987-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178040U true JPH0178040U (it) | 1989-05-25 |
Family
ID=31465783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173897U Pending JPH0178040U (it) | 1987-11-16 | 1987-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178040U (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009290049A (ja) * | 2008-05-30 | 2009-12-10 | Fujitsu Ltd | 絶縁シート、電源回路、及び電子機器 |
-
1987
- 1987-11-16 JP JP1987173897U patent/JPH0178040U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009290049A (ja) * | 2008-05-30 | 2009-12-10 | Fujitsu Ltd | 絶縁シート、電源回路、及び電子機器 |