JPH0178035U - - Google Patents
Info
- Publication number
- JPH0178035U JPH0178035U JP1987173123U JP17312387U JPH0178035U JP H0178035 U JPH0178035 U JP H0178035U JP 1987173123 U JP1987173123 U JP 1987173123U JP 17312387 U JP17312387 U JP 17312387U JP H0178035 U JPH0178035 U JP H0178035U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- resin layer
- conductive path
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173123U JPH0178035U (fr) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173123U JPH0178035U (fr) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178035U true JPH0178035U (fr) | 1989-05-25 |
Family
ID=31465059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173123U Pending JPH0178035U (fr) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178035U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327557A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Works Ltd | 電子部品の製造方法及び半導体装置 |
-
1987
- 1987-11-12 JP JP1987173123U patent/JPH0178035U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327557A (ja) * | 2003-04-22 | 2004-11-18 | Matsushita Electric Works Ltd | 電子部品の製造方法及び半導体装置 |