JPH0178033U - - Google Patents
Info
- Publication number
- JPH0178033U JPH0178033U JP1987173197U JP17319787U JPH0178033U JP H0178033 U JPH0178033 U JP H0178033U JP 1987173197 U JP1987173197 U JP 1987173197U JP 17319787 U JP17319787 U JP 17319787U JP H0178033 U JPH0178033 U JP H0178033U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin molded
- molded case
- metal ring
- assembled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 2
Description
第１図および第２図は樹脂成型ケースを用いた
半導体装置を冷却体に取り付けたときの取り付け
部の要部断面図を示し、第１図は本考案の一実施
例の装置、第２図は従来例の装置に関するもので
ある。第３図は樹脂成型ケースを用いた半導体装
置の一例の外観図を示す。
１……樹脂成型ケース、２……金属ベース、３
……取り付け穴、４……金属リング、５……冷却
体、７……取り付けねじ、８……ばね座金、９…
…平座金。
1 and 2 show cross-sectional views of the main parts of the mounting part when a semiconductor device using a resin molded case is mounted on a cooling body. This relates to a conventional device. FIG. 3 shows an external view of an example of a semiconductor device using a resin molded case. 1...Resin molded case, 2...Metal base, 3
...Mounting hole, 4...Metal ring, 5...Cooling body, 7...Mounting screw, 8...Spring washer, 9...
…Plain washer.
Claims (1)
体装置において、前記ケースに設けられている取
り付け穴に挿嵌されている金属リングの外径寸法
が取り付けねじの大きさに該当するばね座金、平
座金の外径寸法以上であることを特徴とする半導
体装置。 In a semiconductor device that is assembled using a resin molded case, the outer diameter of the metal ring inserted into the mounting hole provided in the case corresponds to the size of the mounting screw. A semiconductor device characterized by having a diameter dimension or larger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173197U JPH0178033U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173197U JPH0178033U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178033U true JPH0178033U (en) | 1989-05-25 |
Family
ID=31465128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173197U Pending JPH0178033U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178033U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332046A (en) * | 1989-06-28 | 1991-02-12 | Mitsubishi Electric Corp | Semiconductor device |
| JP2014138080A (en) * | 2013-01-17 | 2014-07-28 | Mitsubishi Electric Corp | Semiconductor device |
-
1987
- 1987-11-12 JP JP1987173197U patent/JPH0178033U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332046A (en) * | 1989-06-28 | 1991-02-12 | Mitsubishi Electric Corp | Semiconductor device |
| JP2014138080A (en) * | 2013-01-17 | 2014-07-28 | Mitsubishi Electric Corp | Semiconductor device |
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