JPH0178032U - - Google Patents

Info

Publication number

JPH0178032U

JPH0178032U JP1987173904U JP17390487U JPH0178032U JP H0178032 U JPH0178032 U JP H0178032U JP 1987173904 U JP1987173904 U JP 1987173904U JP 17390487 U JP17390487 U JP 17390487U JP H0178032 U JPH0178032 U JP H0178032U

Authority

JP

Japan

Prior art keywords

bonding pad

pad portion

semiconductor device

protective film

surface protective

Prior art date

1987-11-16

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 5
• 239000002184 metal Substances 0.000 claims description 3
• 230000002093 peripheral effect Effects 0.000 claims description 2
• 239000000758 substrate Substances 0.000 claims description 2
• 230000001681 protective effect Effects 0.000 claims 2
• 239000011347 resin Substances 0.000 claims 1
• 229920005989 resin Polymers 0.000 claims 1
• XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
• 229910052710 silicon Inorganic materials 0.000 description 1
• 239000010703 silicon Substances 0.000 description 1