JPH0176081U - - Google Patents
Info
- Publication number
- JPH0176081U JPH0176081U JP1987170143U JP17014387U JPH0176081U JP H0176081 U JPH0176081 U JP H0176081U JP 1987170143 U JP1987170143 U JP 1987170143U JP 17014387 U JP17014387 U JP 17014387U JP H0176081 U JPH0176081 U JP H0176081U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- wiring board
- printed wiring
- wire holder
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 238000010292 electrical insulation Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Installation Of Indoor Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987170143U JPH0176081U (hu) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987170143U JPH0176081U (hu) | 1987-11-09 | 1987-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0176081U true JPH0176081U (hu) | 1989-05-23 |
Family
ID=31460826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987170143U Pending JPH0176081U (hu) | 1987-11-09 | 1987-11-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0176081U (hu) |
-
1987
- 1987-11-09 JP JP1987170143U patent/JPH0176081U/ja active Pending