JPH0176050U - - Google Patents

Info

Publication number

JPH0176050U

JPH0176050U JP1987170989U JP17098987U JPH0176050U JP H0176050 U JPH0176050 U JP H0176050U JP 1987170989 U JP1987170989 U JP 1987170989U JP 17098987 U JP17098987 U JP 17098987U JP H0176050 U JPH0176050 U JP H0176050U

Authority

JP

Japan

Prior art keywords

package

cap

semiconductor device

semiconductor chip

package body

Prior art date

1987-11-09

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 8
• 238000005219 brazing Methods 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 238000007789 sealing Methods 0.000 description 1