JPH0174092U - - Google Patents
Info
- Publication number
- JPH0174092U JPH0174092U JP1987168272U JP16827287U JPH0174092U JP H0174092 U JPH0174092 U JP H0174092U JP 1987168272 U JP1987168272 U JP 1987168272U JP 16827287 U JP16827287 U JP 16827287U JP H0174092 U JPH0174092 U JP H0174092U
- Authority
- JP
- Japan
- Prior art keywords
- cutter
- workpiece surface
- support mechanism
- biasing
- deburring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Cutting Devices (AREA)
- Nonmetal Cutting Devices (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168272U JPH0529784Y2 (US07223432-20070529-C00017.png) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168272U JPH0529784Y2 (US07223432-20070529-C00017.png) | 1987-11-02 | 1987-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0174092U true JPH0174092U (US07223432-20070529-C00017.png) | 1989-05-18 |
| JPH0529784Y2 JPH0529784Y2 (US07223432-20070529-C00017.png) | 1993-07-29 |
Family
ID=31457306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168272U Expired - Lifetime JPH0529784Y2 (US07223432-20070529-C00017.png) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0529784Y2 (US07223432-20070529-C00017.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853890A (zh) * | 2012-09-13 | 2015-08-19 | 陶氏环球技术有限公司 | 用于去除接合多个衬底的多余糊状材料的方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59163421U (ja) * | 1983-04-19 | 1984-11-01 | 大畠 正治 | バリ取り用刃物 |
| JPS6120223U (ja) * | 1984-07-09 | 1986-02-05 | 常盤ステンレス工業株式会社 | バリ取り用カツタ− |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56159973A (en) * | 1980-05-12 | 1981-12-09 | Toshiba Corp | Voltage controlling system for inverter |
-
1987
- 1987-11-02 JP JP1987168272U patent/JPH0529784Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59163421U (ja) * | 1983-04-19 | 1984-11-01 | 大畠 正治 | バリ取り用刃物 |
| JPS6120223U (ja) * | 1984-07-09 | 1986-02-05 | 常盤ステンレス工業株式会社 | バリ取り用カツタ− |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104853890A (zh) * | 2012-09-13 | 2015-08-19 | 陶氏环球技术有限公司 | 用于去除接合多个衬底的多余糊状材料的方法 |
| JP2015529584A (ja) * | 2012-09-13 | 2015-10-08 | ダウ グローバル テクノロジーズ エルエルシー | 複数の基板を接合する余剰ペースト状材料を除去するためのプロセス |
| CN104853890B (zh) * | 2012-09-13 | 2017-10-31 | 陶氏环球技术有限责任公司 | 用于去除接合多个衬底的多余糊状材料的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529784Y2 (US07223432-20070529-C00017.png) | 1993-07-29 |
