JPH0173940U - - Google Patents

Info

Publication number
JPH0173940U
JPH0173940U JP1987169646U JP16964687U JPH0173940U JP H0173940 U JPH0173940 U JP H0173940U JP 1987169646 U JP1987169646 U JP 1987169646U JP 16964687 U JP16964687 U JP 16964687U JP H0173940 U JPH0173940 U JP H0173940U
Authority
JP
Japan
Prior art keywords
semiconductor
jig
bonded together
semiconductor substrates
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987169646U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0650978Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16964687U priority Critical patent/JPH0650978Y2/ja
Publication of JPH0173940U publication Critical patent/JPH0173940U/ja
Application granted granted Critical
Publication of JPH0650978Y2 publication Critical patent/JPH0650978Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
JP16964687U 1987-11-05 1987-11-05 貼り合わせｓｏｉ半導体基板製造用治具 Expired - Lifetime JPH0650978Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16964687U JPH0650978Y2 (ja) 1987-11-05 1987-11-05 貼り合わせｓｏｉ半導体基板製造用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16964687U JPH0650978Y2 (ja) 1987-11-05 1987-11-05 貼り合わせｓｏｉ半導体基板製造用治具

Publications (2)

Publication Number Publication Date
JPH0173940U true JPH0173940U (enrdf_load_stackoverflow) 1989-05-18
JPH0650978Y2 JPH0650978Y2 (ja) 1994-12-21

Family

ID=31459891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16964687U Expired - Lifetime JPH0650978Y2 (ja) 1987-11-05 1987-11-05 貼り合わせｓｏｉ半導体基板製造用治具

Country Status (1)

Country Link
JP (1) JPH0650978Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0650978Y2 (ja) 1994-12-21

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