JPH0173934U - - Google Patents
Info
- Publication number
- JPH0173934U JPH0173934U JP1987170543U JP17054387U JPH0173934U JP H0173934 U JPH0173934 U JP H0173934U JP 1987170543 U JP1987170543 U JP 1987170543U JP 17054387 U JP17054387 U JP 17054387U JP H0173934 U JPH0173934 U JP H0173934U
- Authority
- JP
- Japan
- Prior art keywords
- clamp
- wire
- section
- clamp section
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W70/682—
-
- H10W72/07141—
-
- H10W72/07168—
-
- H10W72/075—
-
- H10W72/07502—
-
- H10W72/5363—
-
- H10W90/754—
Landscapes
- Coiling Of Filamentary Materials In General (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170543U JPH0173934U (enExample) | 1987-11-07 | 1987-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987170543U JPH0173934U (enExample) | 1987-11-07 | 1987-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173934U true JPH0173934U (enExample) | 1989-05-18 |
Family
ID=31461583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987170543U Pending JPH0173934U (enExample) | 1987-11-07 | 1987-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173934U (enExample) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324779A (en) * | 1976-08-20 | 1978-03-07 | Hitachi Ltd | Clamper of wire bonder |
| JPS5326667A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Clamp chip of wire bonder |
| JPS61281533A (ja) * | 1985-06-07 | 1986-12-11 | Hitachi Tokyo Electron Co Ltd | ワイヤボンデイング装置 |
-
1987
- 1987-11-07 JP JP1987170543U patent/JPH0173934U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324779A (en) * | 1976-08-20 | 1978-03-07 | Hitachi Ltd | Clamper of wire bonder |
| JPS5326667A (en) * | 1976-08-25 | 1978-03-11 | Hitachi Ltd | Clamp chip of wire bonder |
| JPS61281533A (ja) * | 1985-06-07 | 1986-12-11 | Hitachi Tokyo Electron Co Ltd | ワイヤボンデイング装置 |
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