JPH0173215U - - Google Patents
Info
- Publication number
- JPH0173215U JPH0173215U JP1987168477U JP16847787U JPH0173215U JP H0173215 U JPH0173215 U JP H0173215U JP 1987168477 U JP1987168477 U JP 1987168477U JP 16847787 U JP16847787 U JP 16847787U JP H0173215 U JPH0173215 U JP H0173215U
- Authority
- JP
- Japan
- Prior art keywords
- metallized layer
- ceramic
- copper plate
- planted
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Finishing Walls (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168477U JPH0173215U (cs) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168477U JPH0173215U (cs) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173215U true JPH0173215U (cs) | 1989-05-17 |
Family
ID=31457688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168477U Pending JPH0173215U (cs) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173215U (cs) |
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1987
- 1987-11-05 JP JP1987168477U patent/JPH0173215U/ja active Pending