JPH0171470U - - Google Patents
Info
- Publication number
- JPH0171470U JPH0171470U JP1987166512U JP16651287U JPH0171470U JP H0171470 U JPH0171470 U JP H0171470U JP 1987166512 U JP1987166512 U JP 1987166512U JP 16651287 U JP16651287 U JP 16651287U JP H0171470 U JPH0171470 U JP H0171470U
- Authority
- JP
- Japan
- Prior art keywords
- dome
- printed circuit
- copper plating
- unloading stock
- covers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166512U JPH0171470U (en, 2012) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166512U JPH0171470U (en, 2012) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171470U true JPH0171470U (en, 2012) | 1989-05-12 |
Family
ID=31453958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166512U Pending JPH0171470U (en, 2012) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171470U (en, 2012) |
-
1987
- 1987-10-30 JP JP1987166512U patent/JPH0171470U/ja active Pending