JPH0171452U - - Google Patents
Info
- Publication number
- JPH0171452U JPH0171452U JP1987166919U JP16691987U JPH0171452U JP H0171452 U JPH0171452 U JP H0171452U JP 1987166919 U JP1987166919 U JP 1987166919U JP 16691987 U JP16691987 U JP 16691987U JP H0171452 U JPH0171452 U JP H0171452U
- Authority
- JP
- Japan
- Prior art keywords
- stacked
- connected circuit
- flat semiconductor
- cooling bodies
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 3
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16691987U JPH0610697Y2 (ja) | 1987-10-30 | 1987-10-30 | 半導体スタック |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16691987U JPH0610697Y2 (ja) | 1987-10-30 | 1987-10-30 | 半導体スタック |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0171452U true JPH0171452U (fr) | 1989-05-12 |
| JPH0610697Y2 JPH0610697Y2 (ja) | 1994-03-16 |
Family
ID=31454739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16691987U Expired - Lifetime JPH0610697Y2 (ja) | 1987-10-30 | 1987-10-30 | 半導体スタック |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610697Y2 (fr) |
-
1987
- 1987-10-30 JP JP16691987U patent/JPH0610697Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0610697Y2 (ja) | 1994-03-16 |