JPH0171451U - - Google Patents

Info

Publication number

JPH0171451U

JPH0171451U JP1987167299U JP16729987U JPH0171451U JP H0171451 U JPH0171451 U JP H0171451U JP 1987167299 U JP1987167299 U JP 1987167299U JP 16729987 U JP16729987 U JP 16729987U JP H0171451 U JPH0171451 U JP H0171451U

Authority

JP

Japan

Prior art keywords

lead

dip type

package body

leads

semiconductor device

Prior art date

1987-10-31

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims 2
• 238000010586 diagram Methods 0.000 description 4
• 238000005476 soldering Methods 0.000 description 2
• 230000002950 deficient Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1