JPH0171434U - - Google Patents
Info
- Publication number
- JPH0171434U JPH0171434U JP16811287U JP16811287U JPH0171434U JP H0171434 U JPH0171434 U JP H0171434U JP 16811287 U JP16811287 U JP 16811287U JP 16811287 U JP16811287 U JP 16811287U JP H0171434 U JPH0171434 U JP H0171434U
- Authority
- JP
- Japan
- Prior art keywords
- rolls
- electronic component
- lead
- frame
- lead forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007493 shaping process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図はこの考案の一実施例を示す正断面図、
第２図は同側面図、第３図は実際の成形加工の状
態を示す側面図、第４図は部分拡大側面図、第５
図は成形状態を示す部分拡大断面図、第６図はフ
レームの平面図、第７図は同側面図、第８図は成
形後の状態を示す側面図である。
１，２……ロール、３，５……溝部、４，６…
…傾斜部、８，９……回転軸、１２……支持枠、
１７……エアシリンダ、Ｆ……フレーム、Ｌ……
リード、Ｍ……モールド部。
FIG. 1 is a front sectional view showing an embodiment of this invention.
Figure 2 is the same side view, Figure 3 is a side view showing the actual forming process, Figure 4 is a partially enlarged side view, and Figure 5 is a side view of the same side.
6 is a plan view of the frame, FIG. 7 is a side view thereof, and FIG. 8 is a side view showing the state after molding. 1, 2... Roll, 3, 5... Groove, 4, 6...
... Inclined part, 8, 9 ... Rotating shaft, 12 ... Support frame,
17...Air cylinder, F...Frame, L...
Lead, M...Mold part.
Claims (1)
子部品をモールドしたモールド部から導出されて
いるリードを所定の形状どおりに成形するのに適
した形状の傾斜部を形成し、互いに回転する前記
両ロール間に前記モールド部を備えたフレームを
通過させて前記リードを成形する電子部品リード
成形装置において、前記両ロールのうちの少なく
とも一方のロールを、他方のロールに対して弾力
的に加圧してなる電子部品リード成形装置。 A pair of rolls is provided, and on the outer periphery of both rolls, an inclined part is formed in a shape suitable for shaping the lead led out from the mold part in which the electronic component is molded into a predetermined shape. In an electronic component lead forming apparatus in which the lead is formed by passing a frame having the mold section between both rolls, at least one of the two rolls is elastically pressed against the other roll. Electronic component lead forming equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16811287U JPH0171434U (en) | 1987-11-02 | 1987-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16811287U JPH0171434U (en) | 1987-11-02 | 1987-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0171434U true JPH0171434U (en) | 1989-05-12 |
Family
ID=31457006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16811287U Pending JPH0171434U (en) | 1987-11-02 | 1987-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0171434U (en) |
-
1987
- 1987-11-02 JP JP16811287U patent/JPH0171434U/ja active Pending