JPH0170514U - - Google Patents
Info
- Publication number
- JPH0170514U JPH0170514U JP1987167060U JP16706087U JPH0170514U JP H0170514 U JPH0170514 U JP H0170514U JP 1987167060 U JP1987167060 U JP 1987167060U JP 16706087 U JP16706087 U JP 16706087U JP H0170514 U JPH0170514 U JP H0170514U
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- molding machine
- resin tablet
- carbide ceramic
- tablet molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000465 moulding Methods 0.000 claims description 3
- 239000012778 molding material Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
Landscapes
- Glanulating (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Description
第１図は、本考案の一実施例になるタブレツト
成形機の要部断面図である。
１…プレス本体、２…ダイス、３…上パンチ、
４…下パンチ、５…ホツパー、６…可撓管、７…
フイーダー、８…成形材料、９…タブレツト。
FIG. 1 is a sectional view of essential parts of a tablet molding machine according to an embodiment of the present invention. 1...Press body, 2...Dice, 3...Upper punch,
4...lower punch, 5...hopper, 6...flexible tube, 7...
Feeder, 8...molding material, 9...tablet.
Claims (1)
料と接触する表面部を炭化ケイ素セラミツクで構
成してなる樹脂タブレツト成形機。 ２ 炭化ケイ素セラミツクが平均５〜１５μｍの
炭化ケイ素の結晶粒からなるものである実用新案
登録請求の範囲第１項記載の樹脂タブレツト成形
機。[Claims for Utility Model Registration] 1. A resin tablet molding machine in which at least the surface portions of the die and punch that come into contact with the molding material are made of silicon carbide ceramic. 2. The resin tablet molding machine according to claim 1, wherein the silicon carbide ceramic is composed of silicon carbide crystal grains with an average size of 5 to 15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167060U JPH0170514U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987167060U JPH0170514U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170514U true JPH0170514U (en) | 1989-05-11 |
Family
ID=31455014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987167060U Pending JPH0170514U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170514U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012214054A (en) * | 2006-10-06 | 2012-11-08 | Hitachi Chemical Co Ltd | Tablet molding die, tablet, method for manufacturing optical semiconductor element-mounting substrate, and optical semiconductor device |
-
1987
- 1987-10-30 JP JP1987167060U patent/JPH0170514U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012214054A (en) * | 2006-10-06 | 2012-11-08 | Hitachi Chemical Co Ltd | Tablet molding die, tablet, method for manufacturing optical semiconductor element-mounting substrate, and optical semiconductor device |
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