JPH0170350U - - Google Patents

Info

Publication number

JPH0170350U

JPH0170350U JP1987163629U JP16362987U JPH0170350U JP H0170350 U JPH0170350 U JP H0170350U JP 1987163629 U JP1987163629 U JP 1987163629U JP 16362987 U JP16362987 U JP 16362987U JP H0170350 U JPH0170350 U JP H0170350U

Authority

JP

Japan

Prior art keywords

resin

substrate

semiconductor element

injection hole

resin injection

Prior art date

1987-10-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 7
• 229920005989 resin Polymers 0.000 claims description 7
• 238000007789 sealing Methods 0.000 claims description 4
• 239000004065 semiconductor Substances 0.000 claims description 4
• 238000002347 injection Methods 0.000 claims description 3
• 239000007924 injection Substances 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 3
• 238000010586 diagram Methods 0.000 description 5
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1