JPH0170213U - - Google Patents
Info
- Publication number
- JPH0170213U JPH0170213U JP1987166487U JP16648787U JPH0170213U JP H0170213 U JPH0170213 U JP H0170213U JP 1987166487 U JP1987166487 U JP 1987166487U JP 16648787 U JP16648787 U JP 16648787U JP H0170213 U JPH0170213 U JP H0170213U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- sheathing
- low dielectric
- adhesive layer
- sandwich
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
Landscapes
- Insulated Conductors (AREA)
Description
図面は本考案の実施例を示すもので、第１図は
本考案低誘電性テープ電線被覆材の一実施例を示
す縦断面図、第２図は第１図の被覆材を使用して
製造されたテープ電線を示す縦断面図である。
１……低誘電性テープ電線被覆材、２……被覆
材本体、３……接着層、４……テープ電線、５…
…導体。
The drawings show an embodiment of the present invention. Fig. 1 is a vertical cross-sectional view showing an embodiment of the low dielectric tape electric wire coating material of the present invention, and Fig. 2 shows an example of the coating material manufactured using the coating material of Fig. 1. FIG. DESCRIPTION OF SYMBOLS 1...Low dielectric tape electric wire coating material, 2...Coating material main body, 3...Adhesive layer, 4...Tape electric wire, 5...
…conductor.
Claims (1)
熱融着されてなるテープ電線に使用される被覆材
であつて、フツ素系樹脂よりなる被覆材本体のシ
ール面にフツ素系樹脂の分散液を塗布して形成さ
れた接着層を設けてなることを特徴とする低誘電
性テープ電線被覆材。 This is a sheathing material used for tape electric wires, which is made by heat-sealing a conductor and two sheathing materials that sandwich the conductor. A low dielectric tape wire covering material comprising an adhesive layer formed by applying a dispersion liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166487U JPH0170213U (en) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987166487U JPH0170213U (en) | 1987-10-30 | 1987-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0170213U true JPH0170213U (en) | 1989-05-10 |
Family
ID=31453912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987166487U Pending JPH0170213U (en) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0170213U (en) |
-
1987
- 1987-10-30 JP JP1987166487U patent/JPH0170213U/ja active Pending