JPH0168623U - - Google Patents
Info
- Publication number
- JPH0168623U JPH0168623U JP1987163259U JP16325987U JPH0168623U JP H0168623 U JPH0168623 U JP H0168623U JP 1987163259 U JP1987163259 U JP 1987163259U JP 16325987 U JP16325987 U JP 16325987U JP H0168623 U JPH0168623 U JP H0168623U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- flanges
- pair
- center conductor
- molded bushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Insulators (AREA)
Description
第1図及び第2図は本考案の一実施例を示す図
で、第1図はモールドブツシングの半分を切欠い
て示す図、第2図は接地側の等電位線の状態を示
す図、第3図乃至第5図は従来例の説明に使用し
た図で、第3図はシールド及びリングを絶縁層内
に内蔵させたモールドブツシングを示す図、第4
図は絶縁層に溝を形成したモールドブツシングを
示す図、第5図は第4図に示したモールドブツシ
ングの等電位線の状態を示す図である。
101……中心導体、102……絶縁層、10
3a,103b……フランジ、104a,104
b……取付板、105……取付用ボルト、106
……接地層。
1 and 2 are diagrams showing one embodiment of the present invention; FIG. 1 is a diagram showing a half of the molded bushing cut away; FIG. 2 is a diagram showing the state of equipotential lines on the ground side; Figures 3 to 5 are diagrams used to explain conventional examples; Figure 3 is a diagram showing a molded bushing in which a shield and a ring are built into an insulating layer;
This figure shows a molded bushing in which grooves are formed in an insulating layer, and FIG. 5 shows the state of equipotential lines of the molded bushing shown in FIG. 4. 101... Center conductor, 102... Insulating layer, 10
3a, 103b...flange, 104a, 104
b...Mounting plate, 105...Mounting bolt, 106
...Ground layer.
Claims (1)
の絶縁層の上記中心導体の軸方向の略中央部に間
隔をもつて形成され少なくとも一方は取付けに供
される一対のフランジと、上記一対のフランジ間
の絶縁層の表面に形成された接地層とを具備した
ことを特徴とするモールドブツシング。 (2) 上記一対のフランジは夫々対向するフラン
ジ側に位置する取付板に固定されるものであるこ
とを特徴とする実用新案登録請求の範囲第1項記
載のモールドブツシング。[Claims for Utility Model Registration] (1) An insulating layer installed around a center conductor, and an insulating layer formed with a spacing approximately in the center of the center conductor in the axial direction, at least one of which is provided for attachment. A molded bushing comprising: a pair of flanges; and a ground layer formed on a surface of an insulating layer between the pair of flanges. (2) The molded bushing according to claim 1, wherein the pair of flanges are fixed to mounting plates located on opposite flange sides.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987163259U JPH0168623U (en) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987163259U JPH0168623U (en) | 1987-10-26 | 1987-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0168623U true JPH0168623U (en) | 1989-05-02 |
Family
ID=31447827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987163259U Pending JPH0168623U (en) | 1987-10-26 | 1987-10-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0168623U (en) |
-
1987
- 1987-10-26 JP JP1987163259U patent/JPH0168623U/ja active Pending
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