JPH0167799U - - Google Patents

Info

Publication number
JPH0167799U
JPH0167799U JP1987163232U JP16323287U JPH0167799U JP H0167799 U JPH0167799 U JP H0167799U JP 1987163232 U JP1987163232 U JP 1987163232U JP 16323287 U JP16323287 U JP 16323287U JP H0167799 U JPH0167799 U JP H0167799U
Authority
JP
Japan
Prior art keywords
ground layer
thick film
integrated circuit
film integrated
different boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987163232U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987163232U priority Critical patent/JPH0167799U/ja
Publication of JPH0167799U publication Critical patent/JPH0167799U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示す一部切欠き斜
視図、第2図は同断面図、第3図は特性図である
。 1……第1の基板、3A……接地用端子部、5
……ハイパスフイルタ回路部、6……接地層、8
……第2の基板、9……ローパスフイルタ回路部

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に回路部を各々実装した異なる基板の裏面
    を貼り合わせて一枚の基板を構成する混成厚膜集
    積回路基板において、前記異なる基板の少なくと
    も一方の裏面に接地層を形成し、この接地層を前
    記回路部の接地用端子部に接続することを特徴と
    する混成厚膜集積回路基板。
JP1987163232U 1987-10-26 1987-10-26 Pending JPH0167799U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987163232U JPH0167799U (ja) 1987-10-26 1987-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987163232U JPH0167799U (ja) 1987-10-26 1987-10-26

Publications (1)

Publication Number Publication Date
JPH0167799U true JPH0167799U (ja) 1989-05-01

Family

ID=31447774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987163232U Pending JPH0167799U (ja) 1987-10-26 1987-10-26

Country Status (1)

Country Link
JP (1) JPH0167799U (ja)

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