JPH0167747U - - Google Patents
Info
- Publication number
- JPH0167747U JPH0167747U JP1987161792U JP16179287U JPH0167747U JP H0167747 U JPH0167747 U JP H0167747U JP 1987161792 U JP1987161792 U JP 1987161792U JP 16179287 U JP16179287 U JP 16179287U JP H0167747 U JPH0167747 U JP H0167747U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- bump
- recess
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161792U JPH0167747U (en18) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161792U JPH0167747U (en18) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167747U true JPH0167747U (en18) | 1989-05-01 |
Family
ID=31445039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161792U Pending JPH0167747U (en18) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167747U (en18) |
-
1987
- 1987-10-22 JP JP1987161792U patent/JPH0167747U/ja active Pending