JPH0167048U - - Google Patents
Info
- Publication number
- JPH0167048U JPH0167048U JP1987162151U JP16215187U JPH0167048U JP H0167048 U JPH0167048 U JP H0167048U JP 1987162151 U JP1987162151 U JP 1987162151U JP 16215187 U JP16215187 U JP 16215187U JP H0167048 U JPH0167048 U JP H0167048U
- Authority
- JP
- Japan
- Prior art keywords
- resistance layer
- heat
- heat resistance
- height
- center portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は、本考案の一実施例を説明する図で、
同図ａは平面図、ｂは側面図、ｃはＢ〜Ｂ′拡大
断面図、ｄはＣ〜Ｃ′拡大断面図、第２図は、従
来のサーマルヘツドの構造を説明する図で、同図
ａ平面図、ｂは側面図、ｃはＡ〜Ａ′拡大断面図
、第３図は、熱転写プリンタの模式的要部側面図
である。
図において、１は放熱基板、２，１４は熱抵抗
層、３は発熱抵抗体、４はリード線、５は耐配化
層、６は耐摩耗層、７，１３はサーマルヘツド、
７１〜７ｎは発熱素子、８は熱転写用リボン、９
は軸、１０はキヤリツジ、１１は丸プラテン、１
２は印字用紙、をそれぞれ示す。
FIG. 1 is a diagram illustrating an embodiment of the present invention.
In the figure, a is a plan view, b is a side view, c is an enlarged sectional view from B to B', d is an enlarged sectional view from C to C', and FIG. 2 is a diagram explaining the structure of a conventional thermal head. Figure a is a plan view, b is a side view, c is an enlarged sectional view from A to A', and Figure 3 is a schematic side view of the main parts of the thermal transfer printer. In the figure, 1 is a heat dissipation board, 2 and 14 are thermal resistance layers, 3 is a heating resistor, 4 is a lead wire, 5 is a wiring-resistant layer, 6 is a wear-resistant layer, 7 and 13 are thermal heads,
7 1 to 7n are heating elements, 8 is a thermal transfer ribbon, 9
is the shaft, 10 is the carriage, 11 is the round platen, 1
2 indicates printing paper.
Claims (1)
に発熱抵抗体３、リード線４、耐配化層５及び耐
摩耗層６を積層してなるサーマルヘツドの構造に
おいて、 前記熱抵抗層１３の中央部の巾を狭くするとと
もに高さを低くして、中央部が細くなる円弧状凹
部を形成したことを特徴とするサーマルヘツドの
構造。[Claims for Utility Model Registration] A thermal device in which a heat resistance layer is provided on a heat dissipation substrate 1, and a heat generating resistor 3, a lead wire 4, a wiring resistance layer 5, and an abrasion resistance layer 6 are laminated on the heat resistance layer. A structure of a thermal head characterized in that the width and height of the center portion of the heat resistance layer 13 are narrowed and the height is reduced to form an arcuate recessed portion with a narrow center portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162151U JPH0167048U (en) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162151U JPH0167048U (en) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167048U true JPH0167048U (en) | 1989-04-28 |
Family
ID=31445716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162151U Pending JPH0167048U (en) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167048U (en) |
-
1987
- 1987-10-22 JP JP1987162151U patent/JPH0167048U/ja active Pending
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