JPH0166713U - - Google Patents

Info

Publication number
JPH0166713U
JPH0166713U JP1987162438U JP16243887U JPH0166713U JP H0166713 U JPH0166713 U JP H0166713U JP 1987162438 U JP1987162438 U JP 1987162438U JP 16243887 U JP16243887 U JP 16243887U JP H0166713 U JPH0166713 U JP H0166713U
Authority
JP
Japan
Prior art keywords
grommet
diameter hole
utility
wall surface
enlarged diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987162438U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987162438U priority Critical patent/JPH0166713U/ja
Publication of JPH0166713U publication Critical patent/JPH0166713U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Insulating Bodies (AREA)
  • Installation Of Indoor Wiring (AREA)
JP1987162438U 1987-10-26 1987-10-26 Pending JPH0166713U (ru)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987162438U JPH0166713U (ru) 1987-10-26 1987-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987162438U JPH0166713U (ru) 1987-10-26 1987-10-26

Publications (1)

Publication Number Publication Date
JPH0166713U true JPH0166713U (ru) 1989-04-28

Family

ID=31446264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987162438U Pending JPH0166713U (ru) 1987-10-26 1987-10-26

Country Status (1)

Country Link
JP (1) JPH0166713U (ru)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009123573A (ja) * 2007-11-16 2009-06-04 Yazaki Corp シール材の充填方法およびシール材の充填装置
JP2010250973A (ja) * 2009-04-10 2010-11-04 Sumitomo Wiring Syst Ltd シールド線端末の止水構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009123573A (ja) * 2007-11-16 2009-06-04 Yazaki Corp シール材の充填方法およびシール材の充填装置
JP2010250973A (ja) * 2009-04-10 2010-11-04 Sumitomo Wiring Syst Ltd シールド線端末の止水構造

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