JPH0165179U - - Google Patents
Info
- Publication number
- JPH0165179U JPH0165179U JP1987159911U JP15991187U JPH0165179U JP H0165179 U JPH0165179 U JP H0165179U JP 1987159911 U JP1987159911 U JP 1987159911U JP 15991187 U JP15991187 U JP 15991187U JP H0165179 U JPH0165179 U JP H0165179U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- foil pattern
- resist
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987159911U JPH0165179U (de) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987159911U JPH0165179U (de) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165179U true JPH0165179U (de) | 1989-04-26 |
Family
ID=31441530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987159911U Pending JPH0165179U (de) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165179U (de) |
-
1987
- 1987-10-21 JP JP1987159911U patent/JPH0165179U/ja active Pending