JPH0165119U - - Google Patents
Info
- Publication number
- JPH0165119U JPH0165119U JP16104187U JP16104187U JPH0165119U JP H0165119 U JPH0165119 U JP H0165119U JP 16104187 U JP16104187 U JP 16104187U JP 16104187 U JP16104187 U JP 16104187U JP H0165119 U JPH0165119 U JP H0165119U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- input
- lead wire
- length
- bored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16104187U JPH0165119U (sv) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16104187U JPH0165119U (sv) | 1987-10-20 | 1987-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0165119U true JPH0165119U (sv) | 1989-04-26 |
Family
ID=31443640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16104187U Pending JPH0165119U (sv) | 1987-10-20 | 1987-10-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0165119U (sv) |
-
1987
- 1987-10-20 JP JP16104187U patent/JPH0165119U/ja active Pending