JPH0160574U - - Google Patents

Info

Publication number

JPH0160574U

JPH0160574U JP15578187U JP15578187U JPH0160574U JP H0160574 U JPH0160574 U JP H0160574U JP 15578187 U JP15578187 U JP 15578187U JP 15578187 U JP15578187 U JP 15578187U JP H0160574 U JPH0160574 U JP H0160574U

Authority

JP

Japan

Prior art keywords

circuit board

printed circuit

heat sink

component unit

clamp member

Prior art date

1987-10-12

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 claims 1
• 230000037431 insertion Effects 0.000 description 1
• 238000003780 insertion Methods 0.000 description 1

Cited By (1)