JPH0159237B2 - - Google Patents
Info
- Publication number
- JPH0159237B2 JPH0159237B2 JP8872881A JP8872881A JPH0159237B2 JP H0159237 B2 JPH0159237 B2 JP H0159237B2 JP 8872881 A JP8872881 A JP 8872881A JP 8872881 A JP8872881 A JP 8872881A JP H0159237 B2 JPH0159237 B2 JP H0159237B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cement
- mold release
- release agent
- enamel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004568 cement Substances 0.000 claims description 20
- 239000006082 mold release agent Substances 0.000 claims description 15
- 238000010304 firing Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 210000003298 dental enamel Anatomy 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000002309 gasification Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Landscapes
- Aftertreatments Of Artificial And Natural Stones (AREA)
Description
【発明の詳細な説明】
本発明はホウロウ引きセメント成型体の製造方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an enameled cement molded body.
含水セメント混和物を型枠成形する場合、その
混和物と型枠との密着のために、成形体の形状い
かんによつては、脱型の際に、成形体に型くずれ
が生じることがある。このため、セメント混和物
に離型剤を添加することがあり、その添加量は、
養生硬化した成形体の強度保持のため、３％以下
とされ（３％以下であれば、離型剤無添加の場合
の70％以上の強度を保障できる）、0.1％以下では
離型効果がない。 When a hydrous cement mixture is molded into a mold, the molded product may lose its shape during demolding, depending on the shape of the molded product, due to the close contact between the mixture and the mold. For this reason, mold release agents are sometimes added to cement mixtures, and the amount added is as follows:
In order to maintain the strength of the cured molded product, it is set at 3% or less (if it is 3% or less, it can guarantee 70% or more of the strength without adding a mold release agent), and if it is 0.1% or less, the mold release effect will not be effective. do not have.
かゝる離型剤添加のセメント製品においては、
離型剤がその撥水性のために、セメント製品の耐
吸水性向上に寄与するところがあるが、しかし、
その効果は小さく、セメント製品が外壁材、屋根
材である場合には、耐水性向上のための処理が必
要である。 In cement products containing such mold release agents,
Mold release agents contribute to improving the water absorption resistance of cement products due to their water repellency, but
The effect is small, and when cement products are used as exterior wall materials or roofing materials, treatment is required to improve water resistance.
この耐水性向上のために、セメント製品にホウ
ロウを焼成することが知られているが、前記した
離型剤添加のセメント製品においては、ホウロウ
焼成の際に、離型剤がガス化し、ホウロウ層にピ
ンボールが生じる危険性がある。 In order to improve this water resistance, it is known that enamel is fired into cement products. However, in cement products with the addition of a mold release agent, the mold release agent is gasified during the enamel firing, and the enamel layer is There is a risk of pinball occurring.
本発明は、セメント組成物を型枠により成形す
る場合、脱型時の離型性付与のためにセメント組
成物に離型剤を添加し、その成形体の養生硬化体
にホウロウをピンホールの発生なく焼成すること
を可能にするホウロウ引きセメント成型体の製造
方法を提案するものである。 In the present invention, when a cement composition is molded using a mold, a mold release agent is added to the cement composition to impart mold releasability during demolding, and enamel is applied to the cured and hardened molded product to form pinholes. This paper proposes a method for manufacturing an enameled cement molded body that enables firing without generation.
すなわち、本発明に係るホウロウ引きセメント
成型体の製造方法は、600℃以下の温度でガス化
する離型剤を0.1〜３重量％添加したセメント質
基材を型枠で成形し、脱型し更に養生した成形体
にホウロウを800〜900℃の温度下で焼成すること
を特徴とする方法である。 That is, the method for producing an enameled cement molded body according to the present invention involves molding a cementitious base material to which 0.1 to 3% by weight of a mold release agent that gasifies at a temperature of 600° C. or lower is added, using a mold, and removing the mold. This method is characterized by further firing enamel on the cured molded body at a temperature of 800 to 900°C.
本発明において、セメント質基材に離型剤を添
加する理由は型枠成形での離型を容易にし、成型
体の型くずれを防止することにあり、その添加量
を0.1〜3.0重量％とした理由は0.1％では離型性を
満足に付与し難く、3.0重量％以上では製品強度
の低下が顕著になるからである。 In the present invention, the reason for adding a mold release agent to the cementitious base material is to facilitate mold release during mold molding and prevent the molded product from deforming, and the amount added is set at 0.1 to 3.0% by weight. The reason is that if it is 0.1%, it is difficult to provide satisfactory mold releasability, and if it is 3.0% by weight or more, the strength of the product will be significantly reduced.
本発明において養生硬化された成型体には離型
剤が含有されており、成型体の施釉したホウロウ
釉薬を焼成する間に離型剤がガス化する。しかし
ながら、離型剤には600℃以下の温度でガス化す
るものを使用しており、そのガス化によるホウロ
ウ層のピンホール発生はない。すなわち、ホウロ
ウの溶融温度が800〜900℃であるため、離型剤が
焼成初期の加熱温度域で分解ガス化して逸散し、
この際、分解ガスが釉層をつき破り、釉層にはピ
ンホールが生じるが、釉薬の焼成温度域に達する
と釉薬が完全に溶融し、前記したピンホールが塞
がれてしまうから、ピンホールのないホウロウ層
を焼付けることができるのである。 In the present invention, the cured molded body contains a mold release agent, and the mold release agent is gasified during firing of the enamel glaze applied to the molded body. However, the mold release agent used is one that gasifies at a temperature of 600°C or lower, and pinholes do not occur in the enamel layer due to gasification. In other words, since the melting temperature of enamel is 800 to 900°C, the mold release agent decomposes and gasifies and escapes in the heating temperature range at the beginning of firing.
At this time, the decomposed gas breaks through the glaze layer and pinholes are created in the glaze layer, but when the glaze reaches the firing temperature range, the glaze completely melts and the pinholes are covered. It is possible to bake an enamel layer without holes.
従つて、本発明によれば、型枠成形が容易でか
つ、ピンホールのないホウロウ層を有するホウロ
ウ引きセメント製品を得ることができる。 Therefore, according to the present invention, it is possible to obtain an enameled cement product that is easy to mold and has an enameled layer without pinholes.
実施例
離型剤には、ガス化温度が500〜550℃の廃油を
使用し、セメント質基材にはセメント：30重量
部、ベントナイト：５重量部、、安山岩：65重量
部、廃油：0.5重量部の組成のものを使用した。Example For the mold release agent, waste oil with a gasification temperature of 500 to 550°C was used, and for the cementitious base material, cement: 30 parts by weight, bentonite: 5 parts by weight, andesite: 65 parts by weight, waste oil: 0.5 A composition of parts by weight was used.
このセメント質基材を約20重量％の水の存在下
で混練し、これを型枠により板状に成形し、該成
形体を脱型後、養生した。型枠からの成形体の脱
型は容易であつた。 This cementitious base material was kneaded in the presence of about 20% by weight of water, molded into a plate shape using a mold, and the molded product was removed from the mold and cured. It was easy to remove the molded product from the mold.
上記養生成形体を300℃で15分間前乾燥し、融
点約800℃のホウロウ釉薬を施釉し、300℃で15分
間乾燥したうえで、850℃、20分間の加熱により
釉薬を焼成した。この焼成後は、製品の強度回復
（焼成温度のためにセメントの結晶水が逸散し、
セメントの強度が低下する）のために10分間の水
中浸漬を行つた。 The cured form was pre-dried at 300°C for 15 minutes, glazed with an enamel glaze having a melting point of about 800°C, dried at 300°C for 15 minutes, and then fired at 850°C for 20 minutes. After this firing, the strength of the product is restored (the crystallization water of the cement is dissipated due to the firing temperature,
The cement was immersed in water for 10 minutes to reduce the strength of the cement.
この水中浸漬の前後の何れにおいても、ホウロ
ウ層にはピンホールがなく、良好なホウロウ引き
セメント系板を得ることができた。 Both before and after this immersion in water, there were no pinholes in the enamel layer, and a good enameled cement board could be obtained.
Claims (1)
３重量％添加したセメント質基材を型枠で成形
し、脱型し更に養生した成形体にホウロウを800
〜900℃の温度下で焼成することを特徴とするホ
ウロウ引きセメント成型体の製造方法。1 Mold release agent that gasifies at a temperature of 600℃ or less
A cement base material containing 3% by weight was molded using a mold, removed from the mold, and then cured.
A method for producing an enameled cement molded body, characterized by firing at a temperature of ~900°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8872881A JPS57205391A (en) | 1981-06-08 | 1981-06-08 | Manufacture of enameled cement moldings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8872881A JPS57205391A (en) | 1981-06-08 | 1981-06-08 | Manufacture of enameled cement moldings |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57205391A JPS57205391A (en) | 1982-12-16 |
| JPH0159237B2 true JPH0159237B2 (en) | 1989-12-15 |
Family
ID=13950972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8872881A Granted JPS57205391A (en) | 1981-06-08 | 1981-06-08 | Manufacture of enameled cement moldings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57205391A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61275151A (en) * | 1985-05-27 | 1986-12-05 | 松下電工株式会社 | Manufacture of cement formed product |
-
1981
- 1981-06-08 JP JP8872881A patent/JPS57205391A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57205391A (en) | 1982-12-16 |
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