JPH0158955U - - Google Patents
Info
- Publication number
- JPH0158955U JPH0158955U JP15425187U JP15425187U JPH0158955U JP H0158955 U JPH0158955 U JP H0158955U JP 15425187 U JP15425187 U JP 15425187U JP 15425187 U JP15425187 U JP 15425187U JP H0158955 U JPH0158955 U JP H0158955U
- Authority
- JP
- Japan
- Prior art keywords
- flat pack
- solder resist
- coated
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15425187U JPH0158955U (de) | 1987-10-07 | 1987-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15425187U JPH0158955U (de) | 1987-10-07 | 1987-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0158955U true JPH0158955U (de) | 1989-04-13 |
Family
ID=31430820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15425187U Pending JPH0158955U (de) | 1987-10-07 | 1987-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0158955U (de) |
-
1987
- 1987-10-07 JP JP15425187U patent/JPH0158955U/ja active Pending