JPH0158952U - - Google Patents
Info
- Publication number
- JPH0158952U JPH0158952U JP15298287U JP15298287U JPH0158952U JP H0158952 U JPH0158952 U JP H0158952U JP 15298287 U JP15298287 U JP 15298287U JP 15298287 U JP15298287 U JP 15298287U JP H0158952 U JPH0158952 U JP H0158952U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit element
- heat dissipation
- heat pipe
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 3
- 239000012530 fluid Substances 0.000 claims 1
- 230000032258 transport Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15298287U JPH0617311Y2 (ja) | 1987-10-06 | 1987-10-06 | マルチチップパッケージにおける回路素子の冷却構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15298287U JPH0617311Y2 (ja) | 1987-10-06 | 1987-10-06 | マルチチップパッケージにおける回路素子の冷却構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0158952U true JPH0158952U (US07413550-20080819-C00001.png) | 1989-04-13 |
JPH0617311Y2 JPH0617311Y2 (ja) | 1994-05-02 |
Family
ID=31428408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15298287U Expired - Lifetime JPH0617311Y2 (ja) | 1987-10-06 | 1987-10-06 | マルチチップパッケージにおける回路素子の冷却構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617311Y2 (US07413550-20080819-C00001.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012015372A (ja) * | 2010-07-01 | 2012-01-19 | Nec Corp | 電子部品の冷却構造、電子部品装置、ヒートシンク |
JP2016072618A (ja) * | 2015-09-02 | 2016-05-09 | 株式会社日立製作所 | 発熱体の冷却構造 |
US9437797B2 (en) | 2014-09-29 | 2016-09-06 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
-
1987
- 1987-10-06 JP JP15298287U patent/JPH0617311Y2/ja not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012015372A (ja) * | 2010-07-01 | 2012-01-19 | Nec Corp | 電子部品の冷却構造、電子部品装置、ヒートシンク |
US9437797B2 (en) | 2014-09-29 | 2016-09-06 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
US9807913B2 (en) | 2014-09-29 | 2017-10-31 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
JP2016072618A (ja) * | 2015-09-02 | 2016-05-09 | 株式会社日立製作所 | 発熱体の冷却構造 |
Also Published As
Publication number | Publication date |
---|---|
JPH0617311Y2 (ja) | 1994-05-02 |