JPH0158952U - - Google Patents

Info

Publication number
JPH0158952U
JPH0158952U JP15298287U JP15298287U JPH0158952U JP H0158952 U JPH0158952 U JP H0158952U JP 15298287 U JP15298287 U JP 15298287U JP 15298287 U JP15298287 U JP 15298287U JP H0158952 U JPH0158952 U JP H0158952U
Authority
JP
Japan
Prior art keywords
heat
circuit element
heat dissipation
heat pipe
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15298287U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0617311Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15298287U priority Critical patent/JPH0617311Y2/ja
Publication of JPH0158952U publication Critical patent/JPH0158952U/ja
Application granted granted Critical
Publication of JPH0617311Y2 publication Critical patent/JPH0617311Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP15298287U 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造 Expired - Lifetime JPH0617311Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15298287U JPH0617311Y2 (ja) 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15298287U JPH0617311Y2 (ja) 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造

Publications (2)

Publication Number Publication Date
JPH0158952U true JPH0158952U (US07413550-20080819-C00001.png) 1989-04-13
JPH0617311Y2 JPH0617311Y2 (ja) 1994-05-02

Family

ID=31428408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15298287U Expired - Lifetime JPH0617311Y2 (ja) 1987-10-06 1987-10-06 マルチチップパッケージにおける回路素子の冷却構造

Country Status (1)

Country Link
JP (1) JPH0617311Y2 (US07413550-20080819-C00001.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015372A (ja) * 2010-07-01 2012-01-19 Nec Corp 電子部品の冷却構造、電子部品装置、ヒートシンク
JP2016072618A (ja) * 2015-09-02 2016-05-09 株式会社日立製作所 発熱体の冷却構造
US9437797B2 (en) 2014-09-29 2016-09-06 Hitachi, Ltd. Cooling structure of heating element and power conversion device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012015372A (ja) * 2010-07-01 2012-01-19 Nec Corp 電子部品の冷却構造、電子部品装置、ヒートシンク
US9437797B2 (en) 2014-09-29 2016-09-06 Hitachi, Ltd. Cooling structure of heating element and power conversion device
US9807913B2 (en) 2014-09-29 2017-10-31 Hitachi, Ltd. Cooling structure of heating element and power conversion device
JP2016072618A (ja) * 2015-09-02 2016-05-09 株式会社日立製作所 発熱体の冷却構造

Also Published As

Publication number Publication date
JPH0617311Y2 (ja) 1994-05-02

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