JPH0158045B2 - - Google Patents

Description

[Detailed description of the invention] (b) Industrial application fields The present invention relates to a method for manufacturing a wire mesh structure.

More specifically, the present invention relates to a method for manufacturing a wire mesh structure having a heat insulating intermediate layer, which is useful as various architectural supports such as cement or concrete cast supports and wall supports.

(b) Conventional technology Structures in which a heat insulating material layer is formed in the center of a three-dimensional (three-dimensional) wire mesh structure have been known for a long time. It is used as timber and wall support. A wire mesh structure having such a heat insulating intermediate layer is
Usually, the metal structure is manufactured by a method in which a urethane foam layer is integrally formed using a urethane liquid only in the central part of the metal structure.

(c) Problems to be Solved by the Invention However, although the urethane foam layer has heat insulating properties, it has insufficient fire resistance, making it insufficient as a building material, and its uses are limited. Furthermore, the formation of the intermediate foam layer is carried out by attaching a wire mesh structure to predetermined upper and lower spacers, interposing an unfoamed urethane liquid between the spacers, and heating and foaming it. In terms of handling, the workability is poor, and it is necessary to use a specific spacer that can hold the urethane liquid in the center of the wire mesh structure, making it difficult to easily manufacture it on site.

This invention was made in view of the above problems, and provides a wire mesh structure that has a heat-insulating intermediate layer that is excellent in fire resistance and lightweight, and can be easily manufactured without requiring a specific spacer or the like. The aim is to provide a manufacturing method for

(d) Means and operation for solving the problem Thus, according to the present invention, a three-dimensional wire mesh structure is installed in a molding mold, and (a) inorganic aggregate particles are placed in the mold. (b) introducing coated particles in which the inorganic aggregate particles are coated with the expandable phenolic resin composition; and (c) reintroducing the inorganic aggregate particles in this order. An inorganic aggregate particle layer is formed in the bottom region of the body, a covering particle layer is formed in the central region, and an inorganic aggregate particle layer is formed in the upper region,
The mold is then heated in a closed state to foam and cure the expandable phenolic resin composition of the coated particles, and then the wire mesh structure is removed from the mold and any inorganic material that may remain in its bottom and top regions is removed. A method of manufacturing a wire mesh structure having a thermally insulating intermediate layer is provided that includes removal of aggregate particles.

One of the most characteristic points of this invention is that when forming a heat insulating layer in the central region of a three-dimensional wire mesh structure, a phenolic resin composite foam containing aggregate particles is applied as the heat insulating layer, and the foamed The main feature is that coated particles, which are aggregate particles coated with an expandable phenolic resin composition, are used as the body material. The other most characteristic feature of this invention is that, in order to easily form this heat insulating layer only in the central region of the structure, an aggregate particle layer is set on the top and bottom regions of the structure when forming the heat insulating layer. The point is that these particle layers are used as a kind of spacer for the covering particles (foamed material).

The three-dimensional wire mesh structure of the present invention is not particularly limited in size, material, etc., as long as it has at least the strength as an architectural structure.

The molding die used in this invention is usually one that corresponds to the above-mentioned wire mesh structure.

Inorganic aggregate particles used in this invention include, for example, perlite, shirasu balloons, glass balloons, glass foam particles, glass cotton particles, rock wool particles, slag, clay cellular particles, sand, plaster particles, and metallic particles. Examples include things. Among these, those with as small a heat capacity as possible are preferable in terms of thermal efficiency during thermoforming, and the particle size is also suitable for handling without being too small (usually 1 mm or more,
Preferably, those having a diameter of 3 to 10 mm) are preferred.
From this point of view, the most preferred inorganic aggregate particles are perlite and foamed glass particles.

The foamed material used in this invention is one in which inorganic aggregate particles are coated with a foamable phenolic resin composition. The term "expandable phenolic resin composition" as used herein refers to a composition containing a so-called phenolic resin initial condensate, a decomposable foaming agent, and a curing agent added as necessary, and optionally a filler. Those available in the form of tablets, tablets, pellets, etc. can be used.

As the above-mentioned phenolic resin initial condensate, so-called resol and noporak are preferably used, and as the decomposition type blowing agent, N,N'-
Organic decomposition blowing agents such as dinitrosopentamethylenetetramine, benzenesulfonyl hydrazide, azobisisobutyronitrile, azodicarbonamide, paratoluenesulfonyl hydrazide, as well as sodium bicarbonate, ammonium carbonate, ammonium bicarbonate, ammonium nitrite, azide compounds Examples include inorganic decomposition type blowing agents such as (eg CaN ₆ ).

Curing agents are also used in particular when novolak type phenolic resin precondensates are used. This curing agent means a compound that can be decomposed by heating and can undergo a crosslinking reaction with the novolak type phenolic resin initial condensate. Examples of such compounds include compounds that are used in the reaction to form phenolic resins, similar to formaldehyde, and are usually in powder form. Specific examples include hexamethylenetetramine, paraformaldehyde, methylal, dioxolane, trioxane, tetraoxane, trimethylolphosphine, S-triazine, and the like. Further, examples of the filler to be mixed include clay, talc, borax, zinc oxide, calcium carbonate, calcium sulfate, carbon black, aluminum oxide, magnesium oxide, lead oxide, and the like.

Examples of the inorganic aggregate particles to be coated with the expandable phenolic resin composition include the various aggregate particles described above. Usually, the aggregate particles used as spacers and the aggregate particles that form the core of the coating particles are of the same type.
Those of the same shape are used, but depending on the case, different types and shapes may be used. However, it is preferable that the shape and size of the aggregate particles used in the lower layer be at least the same as or smaller than the coated particles in order to maintain the separated layer state. It is preferable to make it about the same level as or larger than .

The coated particles are prepared by heating and softening the above-mentioned foamable phenolic resin composition (below the foaming hardening temperature), or in the case of a granular foamable phenolic resin composition, in the presence of a binder such as water or methanol. It can be easily obtained by coating the surface of aggregate particles using a pan-type granulator or the like. Note that it is difficult to form a uniform phenolic resin foam layer containing aggregate particles even if a mixture of a foamable phenolic resin composition and inorganic aggregate particles is simply used.

In this invention, first, a predetermined three-dimensional wire mesh structure is installed in a molding die. This state is the second
An example is shown in the figure. In the figure, 2 indicates a three-dimensional wire mesh structure, and 6 indicates a molding die. Then, as shown in FIG. 3, inorganic aggregate particles 7 are introduced into the mold 6 to form an aggregate particle layer in the bottom region of the structure 2. Note that, depending on the case, the structure 2 may be attached after the introduction of the aggregate particle layer. Next, as shown in FIG.
Inorganic aggregate particles (coated particles) 8 whose surface is coated with an expandable phenolic resin composition are introduced into the inner layer to form a coated particle layer on the previously formed aggregate particle layer, that is,
It is formed in the central region of the structure 2. Furthermore, inorganic aggregate particles 7 are again introduced onto this coated particle layer to form an aggregate particle layer in the upper region of the structure 2, and the mold 6 is closed with a lid 9. This state is shown in FIG.
By heating and curing the expandable phenolic resin composition of the coated particles 8 under such a separated state of each particle layer, the aggregate particles were uniformly contained in the central region of the structure 2. A phenolic resin foam layer is integrally formed. At this time, since a simple layer of aggregate particles 7 is provided in the upper and lower regions, correspondingly no foam layer is formed in the upper and lower regions of the structure. Therefore, these aggregate particles 7 act as a kind of spacer, and as a result, by removing the structure 2 from the mold 6 and removing the aggregate particles 7 that may remain by adhering to the top and bottom parts, as shown in FIG. As shown in FIG. 2, a wire mesh structure 1 having a heat insulating intermediate layer according to the present invention in which the aggregate particle-containing phenolic resin foam layer 3 is formed only in the central region can be easily obtained. Incidentally, a perspective view of the finally obtained wire mesh structure 1 having a heat insulating intermediate layer is shown in FIG. In the figure, 4 indicates pearlite and 5 indicates a phenolic resin foam layer.

The set thickness of the aggregate particle layer that will serve as a spacer should be adjusted to at least the length of the wire mesh structure that you want to expose. It is sufficient to set the protruding frame so that it is exposed on both sides, and usually, the central part coating particle layer is 25 mm wide in the width direction of the wire mesh structure space.
It is sufficient to set it at the time of molding so that it is about ~60%.

(E) Example A foamable phenolic resin composition prepared by mixing the following (a), (b), and (c) was mixed with a roll mixer at 80°C for 5 minutes,
It was then ground to obtain 100 mesh powder.

(a) End-cured novolac type phenol formaldehyde resin (melting point 81℃, gelation time 150℃ 76 seconds)
100 parts by weight (b) Hexamethylenetetramine (curing agent)
10 parts by weight (c) 10 parts by weight of dinitropentamethylenetetramine (degradable blowing agent) Next, this powdered composition was coated on the surface of pearlite (trade name: Fuyolite No. 5; manufactured by Fuyolite Kogyo Co., Ltd.) with an average particle size of 5 mm. . The coating was made using a pan-type granulator, and perlite 10, which is an inorganic aggregate particle, was used for coating.
After spraying (approximately 15 c.c.) water as a binder in the form of a mist with a nozzle to (bulk volume), 400 g of the above foamable phenolic resin composition powder is added and granulated for approximately 5 minutes. Summer.

The thus obtained coated particles were air-dried for one day, and then dried in a hot air circulation constant temperature bath at 70° C. for about 6 hours. These coated particles are aggregate particles in which an expandable phenolic resin composition is adhered to the surface of pearlite particles, and do not peel off even when handled roughly.The coated particles will be coated if left at an ambient temperature of 150°C for about 10 minutes. The resulting phenolic resin composition was foamed to obtain composite grains in which the outer surface of pearlite was covered with a phenolic resin foam.

Next, a three-dimensional grid-like wire structure (250 x 250
x 70 mm, wire diameter 2 mm, grid spacing 70 mm in length, width, and height) as shown in Fig. 2, and place pearlite (Fuyolite 5
) to form a pearlite layer at the bottom of the structure (see Figure 3), and then introduce the above-mentioned coated particles to an apparent average thickness of 40 mm.
A coating particle layer is formed in the center of the structure (see Figure 4), and pearlite (same as above) is further introduced on top of this to form a pearlite layer (apparent thickness 15 mm) on the top of the structure. I let it happen. Next, the lid of the mold was closed (see Figure 5), and the mold was kept at 160°C for 1 hour in a hot air circulation thermostat. After that, the mold is taken out from the thermostatic oven, the three-dimensional wire structure is taken out from the mold, and the pearlite layer held on the upper part and the remaining pearlite attached to the lower part are manually removed. A wire mesh structure of the present invention was obtained, in which a heat insulating layer (insulating intermediate layer) made of a phenolic resin foam layer with a thickness of about 40 mm and containing perlite particles uniformly dispersed was integrated in the center part with a total thickness of 70 mm.

Such a wire mesh structure was useful as a support material for cement implantation, and in particular had good adhesion and retention of cement due to the affinity between phenol and cement and the anchoring effect of the exposed wire mesh.

(F) Effects of the Invention According to the present invention, a wire mesh structure having excellent fire resistance and heat insulation properties can be efficiently manufactured. In particular, it is possible to efficiently obtain a wire mesh structure useful as a cast support material for cement or concrete in terms of its structure and compatibility with the heat insulating layer. The inorganic aggregate particles that act as a kind of spacer are not special, and can be set to any thickness and are easy to handle, so they can be easily used in the field. Furthermore, since the foamed material is not a liquid material like urethane, it is advantageous in terms of handling and obtaining a plate-shaped heat insulating intermediate layer with good reproducibility.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an example of a wire mesh structure having a heat insulating intermediate layer obtained by the method of the present invention, and FIGS. 2 to 6 sequentially explain each step in the method of the present invention. FIG. 1... Wire mesh structure having a heat insulating intermediate layer, 2...
... Three-dimensional wire mesh structure, 3 ... Phenol resin foam layer containing aggregate particles, 4, 7 ... Inorganic aggregate particles, 5 ...
...Phenolic resin foam layer, 6...Molding mold, 8
...Coated particles, 9...Lid.

Claims (1)

[Scope of Claims] 1 A step of installing a three-dimensional wire mesh structure in a molding mold, and (a) introducing inorganic aggregate particles into the mold, (b) foaming the inorganic aggregate particles. By performing the step of introducing the coated particles coated with the synthetic phenolic resin composition and (c) the step of reintroducing the inorganic aggregate particles in this order, an inorganic aggregate particle layer is formed in the bottom region of the wire mesh structure, and a layer of inorganic aggregate particles is formed in the central region. A coated particle layer is formed in the region and an inorganic aggregate particle layer is formed in the upper region, and then the mold is heated in a closed state to foam and harden the expandable phenolic resin composition of the coated particles, and then a wire mesh structure is formed. A method for manufacturing a wire mesh structure with a heat-insulating intermediate layer, characterized in that the body is removed from the mold and the inorganic aggregate particles that may remain in the bottom and top regions thereof are removed. 2. The manufacturing method according to claim 1, wherein the foamable phenolic resin composition comprises a phenolic resin initial condensate, a decomposable foaming agent, and a curing agent added as necessary.