JPH01500391A - electrical circuit interconnection - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The present invention relates to electrical circuit interconnections, and more particularly to semiconductor-type electrical circuit components. This invention relates to a useful type of connector device.

The development of integrated circuits has brought about changes in circuit performance as well as higher density circuit interconnect configurations. Requires circuit path configurations to control the resulting impedance and resistance effects. electricity The traditionally used method for interconnecting electronic circuit components is "ket" type and cooperating contacts are in the open position, and these contacts are then engaged in the closed position. Contains a so-called "zero force" type so that the circuit card can be manipulated when mated. It was. These and other techniques require significant space or Generally, they tend to use complex configurations and elaborate manufacturing procedures. Furthermore, Certain types of commercially used connectors are easily connected to the circuit cards to which they are connected. It simply cannot match the impedance and thus degrades the signal quality. Causes a grating reflex. Such problems arise when the connector has high switching speeds (100 ~500 ps rise time), low switching energy and microvolt range Particularly severe when used in newer generation semiconductors with signal swings that are and the resulting disadvantages include high crosstalk, low rise time, and impedance This includes poor signal quality caused by reflections due to mismatch.

Summary of the invention According to the present invention, a solderless electrical connector device includes a pair of engaged contact terminals. pad-type contact terminals in a first and second planar array for face-to-face engagement to provide so that each pad-type contact terminal has a planar contact surface and a length of the planar contact surface. at least one of each engaged pair having a series of spaced apart scraping edges; first and second planar arrays of pad-type contact terminals having pad-type contact terminals; and the plurality of spaced scraped edges of one contact terminal of each pair to remove surface dirt. the plane of the other contact terminal of each pair in a contact wiping action to remove the other array in a direction transverse to said scraped edge for engagement with the surface. for giving lateral movement of one of the contact terminals of the above arrangement relative to the contact terminals of Including means.

In a preferred embodiment, the continuous scraping edge is at least about 100 microns thick. These scraped edges are located on the sidewalls of pad-type contacts. These scraped edges provide pad-type contact terminals. are defined by recesses in the contact surfaces of and these pad-type contact ends The children consist of stretched rectangles, and these scraped edges They are arranged diagonally to the length of the pad-type contact terminal, and these scraping Preferably, the edges are defined by recesses in the surface of the pad-type contact terminal. each recess is at least about 10 micrometers deep and has a pad type contact. The array moving means extends across the width of the contact terminal and has the contact wiping action. More preferably, it includes a cam structure for providing.

This connector assembly is electrically invisible even at very high frequencies Low crosstalk and high propagation velocity in environmentally reliable high-density interconnects Provides a controlled impedance connection.

Other features and advantages of the invention will be apparent from the following description of specific embodiments in conjunction with the following drawings. This will become clear as the process progresses.

Preferred embodiment We first briefly discuss the drawings.

FIG. 1 is a top view of a printed circuit board having a rectangular array of terminals.

FIG. 2 shows the printed circuit board of FIG. 1 showing the chip carrier module and contact arrangement. 1 is a perspective view of a module-to-board connector assembly according to the present invention for cooperating with a plate; FIG. It is.

FIG. 3 shows the chip carrier module and chip carrier module of FIG. 2 showing a terminal support assembly; FIG. 3 is an exploded perspective view of the components of the contact array.

4 is a plan view of the carrier frame member of FIG. 3; FIG.

5 is a side view of the frame member of FIG. 4; FIG.

FIG. 6 is a cross-sectional view taken along line 6--6 of FIG.

7 is a top view of the contact support bar of the terminal support assembly of FIG. 3; FIG.

FIG. 8 is a front view of the support bar of FIG. 7.

FIG. 9 is a cross-sectional view taken along line 9--9 of FIG.

FIGS. 10A and 10B illustrate the flexibilities used in particular embodiments of the invention. FIG. 3 is a plan view of a bull signal conductor arrangement.

FIG. 10C is an enlarged diagram of the superimposed contact array.

Figure 10D is a top view of the contact arrangement shown in Figure 10C.

FIGS. 11A and 11B show contact pad configurations showing the surface of the scraped edge feature. This is an enlarged view. and Figures 12 and 13 illustrate wiping and electrical connection of the connector assembly of Figure 2. FIG.

Description of specific embodiments Figure 1 shows two rows of terminal arrays 14 (signal terminals 14A and ground terminals 14B). is represented by region 12, with an associated rectangular "footprint" in the form of a pad-type contact terminal. Ru. A line of circuit boards having a substrate 11 on which one or more printed circuits are placed It is a diagram. As shown, terminals 14 are connected to the board through plated through-holes. from the connector trace on the back side of the circuit 12 (inside or outside of the “footprint” 14) (or both).

Each corner of the terminal array has a fastener receiver avertineer 16 and two upright guide bosses. 18 is placed. The substrate 11 is made of polyimide glass, epoxy glass, etc. It is made of a suitable insulating material, and a suitable patch plate 20 is attached to the rear side of the board 11. The child array 14 is fixed in alignment with the alignment post 18 .

A connector assembly 30 is coupled to the printed circuit board 11 and the terminal array 14. (shown in FIG. 2), the connector assembly 80 has circuit elements (shown in FIG. one or more chips or chip carriers not shown) may be installed. The circuit board 10 includes a module 32 that extends in the direction of the contact density of the circuit board 10. flexible conductors (preferably microstrip or strip) 50 ohm characteristic impedance transmission line circuit 36 is soldered. It has a rectangular array of corresponding terminals (not shown). Each flexible circuit 36 has the same dimensions as terminal arrangement 14 and at the other end of the spacing 0, one or more rows of contact pad type terminals.

These four terminal arrays 40 are fixed to corresponding carrier bars 42 and are The rear par 42 is supported by a carrier fin by a post structure 46 and a spring member 48. It is elastically fixed to the frame 44.

A connector assembly 30 is shown in an exploded view in FIG. Further details of 44 are shown with respect to FIGS. 4-6. carrier fly The module 44 has a corner post structure 5 on one side to which the module 32 is fixed. 4. It includes a transverse plate 52 having a diameter of 4. From the other side of the plate 52, a rectangular A shaped cam structure is upright and includes a set of four planar runs. including ramp surfaces 56, each of which is oriented relative to the plane of plate 52. placed at an angle of 60'' at the center of each lamp face 56 and Extending vertically through 56 is an extension slot 58 . lamp structure A fastener aperture 60 is disposed at each corner of the body 56. base play A clearance recess 62 is formed in the slot 52 so as to be generally aligned with the slot 58. The plate 52 has spring tip capture recesses 64 on both sides of each gap recess 62. It is formed.

Each carrier par 42 has a central portion as shown in FIG. 3 and FIGS. It has a flat base surface 70 in which a recess 72 is formed, and a pad 74 The elastic open cell is made such that the outer surface protrudes from the surface 70 of the carrier par 42 by about 1 mm. Polyurethane pad 74 (which may be of the type described in U.S. Pat. No. 4,468.074) ). A threaded fastener recess 76 is disposed at each end of the recess 72. The recess 76 is connected to the associated fastener portion 11B of the flexible transmission line circuit 36. move together. The end faces 80 of the bar 42 are arranged such that these faces are assembled as shown in FIG. placed at 45° to the length of the bar so that they are aligned with each other in the assembly. Each side has a recess 82 (and a corresponding recess 120 (Figures 10A and 10B)). ) are formed for the clamp fastener 88. Laterally from both ends of surface 70, A pair of protrusions 84 are provided, and the protrusions 84 serve as corresponding guides on the substrate 11. A guide slot 86 is defined for receiving and cooperating with the post 18. Each key The carrier par 42 also includes a ramp surface 90 that is connected to the surface 70. The lamp surface 90 is arranged at an angle of 60" to the lamp surface 90. A threaded recess 92 is formed for receiving the seat structure 46.

The carrier pars 42 have their lamp surfaces 90 directly above the frame lamp surface 56. The coupling post structure 46 and spring member 48 It is assembled to the rear frame 44.

As shown in FIG. 2, coupling post structure 46 passes through slot 58. The center portion of each stainless steel spring 48 is screwed into the recess 92 and is captured in the head of its post 46 and its ends are seated within frame recesses 64. This causes the spring 48 to press against the ramp surface 90 of the carrier par 42. offset against and along the frame lamp surface 56 away from the base 52; Ru. The pad-type contact terminal arrangement 40 of the flexible transmission line circuit 36 has a screw-on closure. Secured to carrier par 42 by threaded fastener 98 in fastener recess 76. It is.

In this connector embodiment, two stacked flexible transmission line circuits 3 6 (Figs. 12 and 13) is fixed to each carrier par 42, and the chip cap A terminal density transition is provided between the rear module 32 and the pad type contact terminal array 40. ing. Details of these flexible transmission line circuits 36 are shown in FIGS. Shown with respect to Figure D. Each flexible circuit 36A, 36B is 1 with exposed ground terminal strips at both ends of the circuit. 02, 104 configured with a 1 oz. copper ground plane 100 (ground terminal strip 104 corresponds to contact pad 40A in Figure 10D), low dielectric constant (2,5) and low dielectric 3 mil thick glass reinforced fluorocarbon (Rogers RO-25) with loss factor 00) The dielectric 106 is extended between the terminal pad 110 and the terminal pad 112. A set of 1 oz. copper conductor circuit traces 108A, 108B.

This flexible circuit includes a chip carrier module and a cover film. soldered to the module 32 and the terminal strip 104 and terminal pad 112. Connect the controlled impedance high density transmission line conductor (trace 108) to the terminal It is arranged between the strip 102 and the terminal pad 110 (signal pad 112 corresponds to contact pad 40B of FIG. 10D). Contact pad terminal array 40 A fastener part 116 is provided on both sides of the touch pad terminal array 40, and the fastener part 116 is provided on both sides of the touch pad terminal array 40. The inner portion 116 includes an aperture 118 through which the Ensure that the screw-in fastener 98 (FIG. 2) passes through its corresponding screw-in fastener hole 76. (the fastener portions 116 are approximately 2.5 cm apart).

Conductive circuit traces 108 are 1 oz (1.4 mil) copper and pads 112 are , approximately 2 ounces (approximately 3 mils) copper plated.

To explain FIG. 11A, for example, by photolithography using an appropriate illustration, The planar contact surface 114 of the pad 112 has a diagonal scraped edge 122 (approximately 30 Defined by a recess approximately 1 mil deep and 2 mil wide located at an angle of ) is formed. each approximately 50 microinches thick A layer of nickel and a layer of gold are plated on the surface of the contact pad 112, thereby A planar contact surface is provided having a scraped edge formed therein. Figure 11B In an alternative pad configuration shown in Figure 1, a recess 124' is defined in the sidewall of pad 112'. By doing so, the scraped edge portion 122' is disposed on the planar contact surface 114. .

Referring to FIG. 13, for example, in connection with FIG. 1, the contacts on the circuit board lO The outline of array 14 (and corresponding array 40 on flexible circuit 36) is It is in the shape of The carrier par 42 has a corresponding shape. Right next to each bar 42 The overlying cam structure also has a corresponding overall shape (e.g. see Figure 3). (see Fig. 13), its shape is mainly placed inside the protruding lines P and P2 (Fig. 13). and protrudes from the contour of the carrier par 42 perpendicularly to the surface of the circuit board 10. . The area covered by the starting mechanism, i.e. cam ramp surface 5B, 90, post 46, etc. are substantially the area covered by the interlocking contact arrangement, i.e. l'4.40. are physically identical, which allows adjacent areas of the circuit board to be used, e.g. I try to be free with regard to attachment. For example, the terminal arrangement shown in Figure 1 Within the 14 squares, components, e.g. active electrical components or cooling devices The chair can be mounted on the same side of the board as the contact surface, and other electrical components can be mounted on the same side of the board as the contact surface. It can be attached outside the square of the terminal array on the same side of the board as the surface.

The interaction of contact assembly 28 (FIG. 2) with substrate 11 is described in FIGS. It is shown diagrammatically in the figure. Contact assembly 28 is shown in FIG. The contact pad array 40 is located on the circuit board 10, and the contact pad array 40 is located on the circuit board 10. seated on top of, and offset inwardly from, array 14; Fastener 88 is tightened to attach contact assembly 28 toward substrate 11 (in the direction of arrow 130). When the ramp surface 56 of the frame 44 is pressed against the ramp surface 90 of the carrier par 42, along and against the biasing force of spring 48, resulting in a transverse outward (sliding) movement ( direction of arrow 132) and scraping edges of terminal pads 112 of contact pad array 40. This creates a wiping action on the substrate contact pad array 14 of the groove 122 . This wipe The scrubbing action removes debris and surface dirt and removes spring 48 and pads. Along with the elastic action of pad 74, the approximately 30 psi clamping force provides durable electrical (pulse with 35 ps rise time in pulse generator) low Provides contact resistance (1-3 milliohms) circuit interconnections.

The disclosed connector assembly is relatively inexpensive to manufacture, easy to use, and can be soldered (Easily replaceable mechanical and thermal shock resistant construction) Provides reliable circuit interconnection with multiple electrical connections. specific Although embodiments have been shown and described, various modifications will be apparent to those skilled in the art. , it is therefore not intended that the invention be limited to the disclosed embodiments or details thereof. However, deviations may be made within the spirit and scope of the invention.

IG 3 international search report

Claims (8)

[Claims] 1. In a solderingless electrical connector device, providing a mated pair of contact terminals. first and second planar array pad-type contact terminals for face-to-face engagement for pad-type contact terminals spaced apart along the planar contact surface and the length of the planar contact surface; at least one patch of each engaged pair having a series of scraping edges; first and second planar arrays of pad-type contact terminals having pad-type contact terminals; and Remove surface dirt from the above multiple spaced scraping edges of one contact terminal of each pair. The plane surface of the other contact terminal of each pair in contact wiping action to remove the other array in a direction transverse to said scraped edge to engage the surface. a hand for imparting lateral movement of one of the contact terminals in the above arrangement relative to the contact terminals; step An electrical connector device comprising: 2. The continuous edge of the scraped edge is at least about 100 micrometers long. The connector device according to claim 1, wherein the connector device is spaced apart from each other. 3. The scraped edge is formed by a recess in the side wall of the pad type contact terminal. 3. Apparatus according to claims 1 and 2, characterized in that: 4. The scraping edge is removed by the recess on the contact surface of the pad type contact terminal. 3. A device according to claim 1 or 2, characterized in that the device is defined by: 5. each said recess is at least about 10 micrometers deep and said pad Claim 4, characterized in that the contact terminal extends across the width of the double-type contact terminal. Equipment described in Section. 6. The preceding claims characterized in that the pad-type contact terminal is rectangular. Equipment described in any section of. 7. The scraped edge is diagonal to the length of the pad type contact terminal. A device according to any preceding claim, characterized in that it is arranged. 8. The array moving means includes a cam structure for providing the contact wiping action. Apparatus according to any preceding claim, characterized in that it comprises: